Inventor · disambiguated record
Tsung-Ding Wang
Also filed as: WANG TSUNG-DING
106 granted patents·34 pending applications·2,396 citations·filing 2008–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD103TAIWAN SEMICONDUCTOR MFG11WANG TSUNG-DING8PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC3CHEN HSIEN-WEI2
Top patents by PatentIndex Score
140 records- 0199US9768145B2Methods of forming multi-die package structures including redistribution layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 19, 2017·47 cites·20 claims
- 0299US9496189B2Stacked semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 15, 2016·1.8k cites·19 claims
- 0398US11244879B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·7 cites·20 claims
- 0497US11270921B2Semiconductor package including dies having high-modulus dielectric layer and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 8, 2022·6 cites·20 claims
- 0597US11101209B2Redistribution structures in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·20 cites·19 claims
- 0697US9343433B2Packages with stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 17, 2016·31 cites·20 claims
- 0797US9275924B2Semiconductor package having a recess filled with a molding compoundWANG TSUNG-DING·Filed 2012·Granted Mar 1, 2016·64 cites·19 claims
- 0896US11961777B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 0996US10804242B2Methods of forming multi-die package structures including redistribution layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 13, 2020·9 cites·20 claims
- 1096US9935090B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 3, 2018·18 cites·20 claims
- 1196US9564416B2Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 7, 2017·25 cites·20 claims
- 1295US10026671B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 17, 2018·27 cites·20 claims
- 1395US8823180B2Package on package devices and methods of packaging semiconductor diesWANG TSUNG-DING·Filed 2012·Granted Sep 2, 2014·30 cites·18 claims
- 1494US8803332B2Delamination resistance of stacked dies in die sawLEE BO-I·Filed 2010·Granted Aug 12, 2014·29 cites·20 claims
- 1593US10319607B2Package-on-package structure with organic interposerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 11, 2019·16 cites·20 claims
- 1693US9653443B2Thermal performance structure for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 16, 2017·13 cites·19 claims
- 1793US8704354B2Package on package structures and methods for forming the sameCHENG JUNG WEI·Filed 2012·Granted Apr 22, 2014·14 cites·20 claims
- 1892US12199065B2Multi-die package structures including redistribution layersPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2020·Granted Jan 14, 2025·2 cites·19 claims
- 1992US11894341B2Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 2092US9502383B23D integrated circuit package processing with panel type lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·10 cites·17 claims
- 2191US9355933B2Cooling channels in 3DIC stacksTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·9 cites·20 claims
- 2291US9059109B2Package assembly and method of forming the sameLIN HUNG-JEN·Filed 2012·Granted Jun 16, 2015·15 cites·20 claims
- 2390US11705378B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 2490US9006032B2Package on package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 14, 2015·9 cites·20 claims
- 2589US8743561B2Wafer-level molded structure for package assemblyWANG TSUNG-DING·Filed 2010·Granted Jun 3, 2014·9 cites·8 claims
- 2689US8426256B2Method of forming stacked-die packagesHSIAO C W·Filed 2010·Granted Apr 23, 2013·21 cites·20 claims
- 2788US12494455B2Multi-die package structures including an interconnected package component disposed in a substrate cavityPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2024·Granted Dec 9, 2025·0 cites·20 claims
- 2888US11145639B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·5 cites·20 claims
- 2988US11088069B2Semiconductor package and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·5 cites·20 claims
- 3088US10056267B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 21, 2018·7 cites·20 claims
- 3187US12506115B2Multi-die package structures including redistribution layersPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2024·Granted Dec 23, 2025·0 cites·19 claims
- 3287US10020236B2Dam for three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 10, 2018·6 cites·20 claims
- 3387US9437551B2Concentric bump design for the alignment in die stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 6, 2016·7 cites·20 claims
- 3487US8658464B2Mold chase design for package-on-package applicationsCHENG JUNG WEI·Filed 2011·Granted Feb 25, 2014·10 cites·18 claims
- 3586US10074604B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·5 cites·20 claims
- 3686US9824902B1Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 21, 2017·5 cites·11 claims
- 3786US9754917B2Method of forming wafer-level molded structure for package assemblyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 5, 2017·4 cites·20 claims
- 3886US9240387B2Wafer-level chip scale package with re-workable underfillCHEN HSIEN-WEI·Filed 2011·Granted Jan 19, 2016·8 cites·17 claims
- 3985US12482790B2Packages with stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 4085US9691723B2Connector formation methods and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 27, 2017·3 cites·20 claims
- 4185US9406632B2Semiconductor package including a substrate with a stepped sidewall structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·6 cites·20 claims
- 4285US8803323B2Package structures and methods for forming the sameYU CHEN-HUA·Filed 2012·Granted Aug 12, 2014·7 cites·13 claims
- 4384US9673158B2Formation of connectors without UBMTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 6, 2017·4 cites·20 claims
- 4483US12506116B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 23, 2025·1 cites·20 claims
- 4583US11404342B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·2 cites·20 claims
- 4683US7687311B1Method for producing stackable diesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Mar 30, 2010·11 cites·19 claims
- 4783US2025311102A1Laminated structure with padsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4882US10867949B2Substrate design for semiconductor packages and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·20 claims
- 4982US9721916B2Concentric bump design for the alignment in die stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 1, 2017·3 cites·20 claims
- 5081US12362321B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
Showing the top 50 of 140 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →