Inventor · disambiguated record
Tsung-Hua Wu
Also filed as: WU TSUNG-HUA
19 granted patents·6 pending applications·154 citations·filing 1999–2025
94Inventor score
Files withADVANCED SEMICONDUCTOR ENG16SENSORTEK TECH CORP3ASUSTEK COMP INC1HUANG MIN-LUNG1MOSEL VITELIC INC1
Top patents by PatentIndex Score
25 records- 0181US6664128B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Dec 16, 2003·25 cites·15 claims
- 0272US7518241B2Wafer structure with a multi-layer barrier in an UBM layer network device with power supplyADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Apr 14, 2009·7 cites·14 claims
- 0372US6692581B2Solder paste for fabricating bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·18 cites·12 claims
- 0472US6617237B1Lead-free bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Sep 9, 2003·19 cites·25 claims
- 0569US6846719B2Process for fabricating wafer bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 25, 2005·16 cites·18 claims
- 0666US6916732B2Method of forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 12, 2005·11 cites·21 claims
- 0765US7955100B2Connector and electronic device having the sameASUSTEK COMP INC·Filed 2010·Granted Jun 7, 2011·5 cites·14 claims
- 0862US7221052B2Chip scale package with micro antenna and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 22, 2007·2 cites·8 claims
- 0960US6732912B2Solder ball attaching processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted May 11, 2004·8 cites·29 claims
- 1059US2025251276A1Light sensing method and light sensor module thereofSENSORTEK TECH CORP·Filed 2025·Application pending·0 cites
- 1158US11513001B2Light sensor module including a polarizing element to block display lightSENSORTEK TECH CORP·Filed 2020·Granted Nov 29, 2022·0 cites·12 claims
- 1257US7375020B2Method of forming bumpsADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted May 20, 2008·6 cites·10 claims
- 1356US6720244B2Bump fabrication methodADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 13, 2004·7 cites·18 claims
- 1455US7064428B2Wafer-level package structureADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Jun 20, 2006·6 cites·6 claims
- 1553US6927964B2Structure for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 9, 2005·4 cites·9 claims
- 1648US6967153B2Bump fabrication processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 22, 2005·2 cites·27 claims
- 1747US6756256B2Method for preventing burnt fuse pad from further electrical connectionADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jun 29, 2004·2 cites·8 claims
- 1846US6877653B2Method of modifying tin to lead ratio in tin-lead bumpADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 12, 2005·1 cites·15 claims
- 1945US6713320B2Bumping processADVANCED SEMICONDUCTOR ENG·Filed 2002·Granted Mar 30, 2004·1 cites·20 claims
- 2045US6374833B1Method of in situ reactive gas plasma treatmentMOSEL VITELIC INC·Filed 1999·Granted Apr 23, 2002·14 cites·18 claims
- 2145US2021325253A1Optical sensing method and optical sensor module thereofSENSORTEK TECH CORP·Filed 2020·Application pending·0 cites
- 2240US2005161812A1Wafer-level package structureFiled 2005·Application pending·0 cites
- 2339US2003161123A1Bonding structure for bonding substrates by metal studsFiled 2003·Application pending·0 cites
- 2438US2006276023A1Method for forming bumpsHUANG MIN-LUNG·Filed 2006·Application pending·0 cites
- 2537US2003160335A1Flip chip interconnection structure and fabrication process thereofFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →