Inventor · disambiguated record
Tsung-Huan Wu
Also filed as: WU TSUNG H · WU TSUNG-HUAN
0 granted patents·2 pending applications·0 citations·filing 2005–2023
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0145US2024371803A1Method for forming a redistribution layer structure, and chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0238US2006134884A1Wafer structure, chip structure, and fabricating process thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →