Inventor · disambiguated record

Tsui Y. Yao

Also filed as: YAO TSUI Y

1 granted patent·59 citations·filing 1990–1990

50Inventor score

Technology areasH10D

Files withNORTH AMERICAN PHILIPS CORP SI1

Top patents by PatentIndex Score

1 record

0179US5094981ATechnique for manufacturing interconnections for a semiconductor device by annealing layers of titanium and a barrier material above 550° C.NORTH AMERICAN PHILIPS CORP SI·Filed 1990·Granted Mar 10, 1992·59 cites·25 claims

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