Inventor · disambiguated record
Tsan-Lien Yeh
Also filed as: YEH TSAN-LIEN
1 granted patent·2 pending applications·11 citations·filing 2011–2017
33Inventor score
Top patents by PatentIndex Score
3 records- 0183US9831197B1Wafer-level package with metal shielding structure and the manufacturing method thereofSIGURD MICROELECTRONICS CORP·Filed 2017·Granted Nov 28, 2017·11 cites·12 claims
- 0229US2012025211A1Compact sensor package structureYEH TSAN-LIEN·Filed 2011·Application pending·0 cites
- 0325US2016207762A1Sensor package structure and methodSIGURD MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →