Inventor · disambiguated record
Tsung-Yuan Yu
Also filed as: YU TSUNG-YUAN
108 granted patents·20 pending applications·450 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD90TAIWAN SEMICONDUCTOR MFG26YU TSUNG-YUAN4CHEN HSIEN-WEI2CHEN JIE1
Top patents by PatentIndex Score
128 records- 0199US9275925B2System and method for an improved interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 1, 2016·64 cites·20 claims
- 0298US12132024B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 29, 2024·4 cites·20 claims
- 0398US11139249B2Semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 5, 2021·6 cites·20 claims
- 0498US9257333B2Interconnect structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·77 cites·20 claims
- 0598US8987922B2Methods and apparatus for wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 24, 2015·65 cites·20 claims
- 0697US11809000B2Photonic integrated circuit and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·4 cites·20 claims
- 0796US11251119B2Package structure, package-on-package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 0895US11614592B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 28, 2023·3 cites·20 claims
- 0995US8581400B2Post-passivation interconnect structureLIANG SHIH-WEI·Filed 2011·Granted Nov 12, 2013·22 cites·20 claims
- 1093US9437739B2Finfet seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 6, 2016·15 cites·20 claims
- 1193US9337154B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 10, 2016·14 cites·20 claims
- 1293US9305877B13D package with through substrate viasTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 5, 2016·14 cites·20 claims
- 1392US9349665B2Methods and apparatus of packaging of semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 24, 2016·14 cites·20 claims
- 1491US9490203B2Capacitor in post-passivation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 8, 2016·5 cites·20 claims
- 1591US8581389B2Uniformity control for IC passivation structureCHEN HSIEN-WEI·Filed 2011·Granted Nov 12, 2013·12 cites·20 claims
- 1690US9245842B2Semiconductor devices having guard ring structure and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 26, 2016·10 cites·20 claims
- 1790US9013038B2Semiconductor device with post-passivation interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 21, 2015·9 cites·18 claims
- 1889US9269682B2Method of forming bump structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 23, 2016·10 cites·19 claims
- 1987US9831205B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 28, 2017·6 cites·20 claims
- 2087US8624359B2Wafer level chip scale package and method of manufacturing the sameYANG CHUNG-YING·Filed 2011·Granted Jan 7, 2014·7 cites·22 claims
- 2186US10043770B2System and method for an improved interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 7, 2018·3 cites·20 claims
- 2286US8957503B2Chip package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 17, 2015·6 cites·15 claims
- 2386US2025355202A1Photonic integrated circuit and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2486US2025349778A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2586US2025347862A1Method of making semiconductor device including optical through via and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2685US9786591B2Capacitor in post-passivation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·3 cites·20 claims
- 2784US12210200B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 28, 2025·0 cites·20 claims
- 2884US9355906B2Packaging devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 31, 2016·4 cites·16 claims
- 2984US9000876B2Inductor for post passivation interconnectTSAI HAO-YI·Filed 2012·Granted Apr 7, 2015·6 cites·16 claims
- 3084US2025123458A1Photonic Semiconductor Device and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3183US12362329B2Method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 3283US9633963B2Packaging devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 25, 2017·2 cites·20 claims
- 3383US9269658B2Ball amount process in the manufacturing of integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 23, 2016·5 cites·20 claims
- 3483US9006891B2Method of making a semiconductor device having a post-passivation interconnect structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·5 cites·20 claims
- 3581US12266639B2Method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 3681US12105323B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 3781US11947173B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 2, 2024·0 cites·20 claims
- 3881US10079213B2Packaging devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 18, 2018·2 cites·20 claims
- 3981US9396973B2Methods and apparatus for wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·3 cites·21 claims
- 4081US9355954B2Capacitor in post-passivation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 31, 2016·2 cites·20 claims
- 4181US8994181B2Bond pad structure to reduce bond pad corrosionCHEN YING-JU·Filed 2011·Granted Mar 31, 2015·6 cites·20 claims
- 4280US12442995B2Photonic integrated circuit and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 14, 2025·0 cites·20 claims
- 4380US2025070013A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4480US2024369759A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4580US2024395756A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4680US2025357298A13d stacking structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4779US2025349693A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4878US12176282B2Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 4978US9984965B2Inductor system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 29, 2018·1 cites·20 claims
- 5078US9406739B2Inductor system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·2 cites·20 claims
Showing the top 50 of 128 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →