Inventor · disambiguated record
Tung Yao Lin
Also filed as: LIN TUNG · LIN TUNG YAO
6 granted patents·2 pending applications·4 citations·filing 2017–2025
71Inventor score
Top patents by PatentIndex Score
8 records- 0186US11817421B2Method for manufacturing semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 14, 2023·2 cites·19 claims
- 0286US11652081B2Method for manufacturing semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted May 16, 2023·2 cites·19 claims
- 0381US12218094B2Electronic package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted Feb 4, 2025·0 cites·20 claims
- 0469US12500205B2Method for manufacturing semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 16, 2025·0 cites·6 claims
- 0569US2025157972A1Electronic package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0668US11935855B2Electronic package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Mar 19, 2024·0 cites·10 claims
- 0762US10686194B2Cathode material for a solid oxide fuel cell and method for making the sameUNIV NAT TAIPEI TECHNOLOGY·Filed 2017·Granted Jun 16, 2020·0 cites·11 claims
- 0853US2025069901A1Method for manufacturing package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →