Inventor · disambiguated record
Tung-Liang Shao
Also filed as: SHAO TUNG-LIANG
78 granted patents·43 pending applications·500 citations·filing 2001–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD101TAIWAN SEMICONDUCTOR MFG7AU OPTRONICS CORP4SHAO TUNG-LIANG2APACK TECHNOLOGIES INC1
Top patents by PatentIndex Score
121 records- 0199US8531032B2Thermally enhanced structure for multi-chip deviceYU CHEN-HUA·Filed 2011·Granted Sep 10, 2013·72 cites·7 claims
- 0298US11996351B2Packaged semiconductor device including liquid-cooled lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·20 cites·20 claims
- 0398US11387164B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 12, 2022·19 cites·20 claims
- 0497US8754514B2Multi-chip wafer level packageYU CHUN HUI·Filed 2011·Granted Jun 17, 2014·107 cites·20 claims
- 0597US8476770B2Apparatus and methods for forming through viasSHAO TUNG-LIANG·Filed 2011·Granted Jul 2, 2013·58 cites·14 claims
- 0696US11410910B2Packaged semiconductor device including liquid-cooled lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·3 cites·20 claims
- 0794US11456256B2Semiconductor device, stacked semiconductor device and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·3 cites·20 claims
- 0893US9153504B2Metal insulator metal capacitor and method for making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·13 cites·20 claims
- 0992US9576929B1Multi-strike process for bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 21, 2017·9 cites·20 claims
- 1091US9490203B2Capacitor in post-passivation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 8, 2016·5 cites·20 claims
- 1190US11955378B2Bonding method of package components and bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 9, 2024·1 cites·20 claims
- 1290US9136143B2Thermally enhanced structure for multi-chip deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·8 cites·18 claims
- 1390US8618827B2Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor deviceSHAO TUNG-LIANG·Filed 2010·Granted Dec 31, 2013·12 cites·20 claims
- 1489US12272616B2Heat-dissipating structures for semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·1 cites·20 claims
- 1589US9997467B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 12, 2018·5 cites·20 claims
- 1689US8227822B2Light emitting diode apparatusHUNG CHUN CHANG·Filed 2009·Granted Jul 24, 2012·30 cites·14 claims
- 1788US11443981B2Bonding method of package components and bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·20 claims
- 1886US10141291B2Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 27, 2018·5 cites·20 claims
- 1985US9947630B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 17, 2018·3 cites·20 claims
- 2085US9786591B2Capacitor in post-passivation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·3 cites·20 claims
- 2185US9048149B2Self-alignment structure for wafer level chip scale packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 2, 2015·6 cites·20 claims
- 2285US6387795B1Wafer-level packagingAPACK TECHNOLOGIES INC·Filed 2001·Granted May 14, 2002·41 cites·6 claims
- 2384US12341081B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
- 2484US10153218B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·4 cites·20 claims
- 2584US7821595B2Backlight moduleAU OPTRONICS CORP·Filed 2010·Granted Oct 26, 2010·8 cites·24 claims
- 2684US7782418B2Backlight moduleAU OPTRONICS CORP·Filed 2008·Granted Aug 24, 2010·14 cites·8 claims
- 2784US2025357420A1Chip package structure with redistribution layer having bonding portionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2883US9530715B2Thermally enhanced structure for multi-chip deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·3 cites·20 claims
- 2983US2025347869A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3083US2025347849A1Optical devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3183US2025347871A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3282US12278199B2Conductive bump of a semiconductor device and fabricating method thereof cross reference to related applicationsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 3382US10354986B2Hollow metal pillar packaging schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·2 cites·20 claims
- 3482US9559044B2Package with solder regions aligned to recessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·4 cites·20 claims
- 3582US2024379569A1Manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3682US2025341691A1Optical coupling adapter for fiber-to-chip integrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3782US2025309189A1Bonding with pre-deoxide process and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3881US10985121B2Bump structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 20, 2021·2 cites·20 claims
- 3981US10854580B2Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·2 cites·20 claims
- 4081US10734348B2Bonded semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·2 cites·19 claims
- 4181US9355954B2Capacitor in post-passivation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 31, 2016·2 cites·20 claims
- 4280US11901263B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 4380US10468385B2Semiconductor structure including plurality of chips along with air gap and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·2 cites·19 claims
- 4480US2025357409A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4580US2025364356A1Package with Improved Heat Dissipation Efficiency and Method for Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4680US2025355163A1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4780US2025347846A1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4879US12125794B2Semiconductor device and manufacturing method of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 4979US8963328B2Reducing delamination between an underfill and a buffer layer in a bond structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 24, 2015·4 cites·19 claims
- 5079US8685798B2Methods for forming through viasTAIWAN SEMICONDUCTOR MANUFACTING COMPANY LTD·Filed 2013·Granted Apr 1, 2014·5 cites·20 claims
Showing the top 50 of 121 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →