Inventor · disambiguated record
Tung-Heng Shie
Also filed as: SHIE TUNG-HENG
4 granted patents·35 citations·filing 2001–2006
73Inventor score
Files withTAIWAN SEMICONDUCTOR MFG4
Top patents by PatentIndex Score
4 records- 0172US6696356B2Method of making a bump on a substrate without ribbon residueTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 24, 2004·23 cites·30 claims
- 0256US7678655B2Spacer layer etch method providing enhanced microelectronic device performanceTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 16, 2010·1 cites·20 claims
- 0355US6926818B1Method to enhance the adhesion between dry film and seed metalTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 9, 2005·7 cites·50 claims
- 0453US6828198B2System-on-chip (SOC) solutions with multiple devices by multiple poly gate trimming processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Dec 7, 2004·4 cites·43 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →