Inventor · disambiguated record
Tushar Talukdar
Also filed as: TALUKDAR TUSHAR · TALUKDAR TUSHAR KANTI
1 granted patent·32 pending applications·0 citations·filing 2020–2024
14Inventor score
Top patents by PatentIndex Score
33 records- 0174US2025040231A1Gallium nitride (gan) three-dimensional integrated circuit technologyINTEL CORP·Filed 2024·Application pending·0 cites
- 0267US2025108459A1Protective debonding stack for selective transferINTEL CORP·Filed 2023·Application pending·0 cites
- 0364US12148747B2Gallium nitride (GAN) three-dimensional integrated circuit technologyINTEL CORP·Filed 2020·Granted Nov 19, 2024·0 cites·21 claims
- 0458US2025300129A1Integrated circuit packages including multi-die stacks having tapered sidewallsINTEL CORP·Filed 2024·Application pending·0 cites
- 0557US2025273478A1Infrared laser debond process for fusion-bonded or hybrid-bonded die complexes on reusable carrier wafersINTEL CORP·Filed 2024·Application pending·0 cites
- 0657US2025105053A1Selective transfer of optical and opto-electronic componentsINTEL CORP·Filed 2023·Application pending·0 cites
- 0757US2025273557A1Laser debond process for fabrication of high-density organic interposersINTEL CORP·Filed 2024·Application pending·0 cites
- 0856US2025112210A1Fine-grain integration of group iii-v devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 0956US2025105136A1Capacitors for use with integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1056US2025112077A1Architectures for facilitating bonding in wafer-level selective transfersINTEL CORP·Filed 2023·Application pending·0 cites
- 1156US2025112208A1Selective layer transfer with glass panelsINTEL CORP·Filed 2023·Application pending·0 cites
- 1256US2025112196A1Selective transfer of thermal management diesINTEL CORP·Filed 2023·Application pending·0 cites
- 1356US2025112218A1Selective layer transfer process improvementsINTEL CORP·Filed 2023·Application pending·0 cites
- 1456US2025105046A1Selective layer transferINTEL CORP·Filed 2023·Application pending·0 cites
- 1555US2025112188A1Fine-grain integration of radio frequency antennas, interconnects, and passivesINTEL CORP·Filed 2023·Application pending·0 cites
- 1655US2025112204A1Disaggregated processor architectures using selective transfer technologyINTEL CORP·Filed 2023·Application pending·0 cites
- 1755US2025112067A1Removal of defective dies on donor wafers for selective layer transferINTEL CORP·Filed 2023·Application pending·0 cites
- 1854US2025105025A1Blanket wafer laser pre-exposure for fast selective layer transfersINTEL CORP·Filed 2023·Application pending·0 cites
- 1953US2025112092A1Structural support layer to protect selective transfer layer during laser exposure of unbonded wafersINTEL CORPORTATION·Filed 2023·Application pending·0 cites
- 2051US2024063072A1Laser assisted etching of dielectrics in ic devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 2150US2024063076A1Integrated conformal thermal heat spreader for multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 2250US2024063089A1Thermal management of base dies in multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 2350US2025112145A1Methods and apparatus to improve interconnect structures in integrated circuit packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 2450US2024063143A1Device, method, and system to mitigate warpage of a composite chipletINTEL CORP·Filed 2022·Application pending·0 cites
- 2550US2024063180A1Ic die composites with inorganic inter-die fill structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 2650US2024063147A1Device, method, and system to protect through-dielectric vias of a composite chipletINTEL CORP·Filed 2022·Application pending·0 cites
- 2748US2024063142A1Die crack mitigation in multi-chip composite ic structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 2846US2023054719A1Gallium nitride (gan) layer transfer and regrowth for integrated circuit technologyINTEL CORP·Filed 2021·Application pending·0 cites
- 2945US2022102344A1Gallium nitride (gan) three-dimensional integrated circuit technologyINTEL CORP·Filed 2020·Application pending·0 cites
- 3045US2023066336A1Gallium nitride (gan) epitaxy on patterned substrate for integrated circuit technologyINTEL CORP·Filed 2021·Application pending·0 cites
- 3144US2023090106A1Gallium nitride (gan) layer transfer for integrated circuit technologyINTEL CORP·Filed 2021·Application pending·0 cites
- 3244US2023069054A1Gallium nitride (gan) integrated circuit technology with multi-layer epitaxy and layer transferINTEL CORP·Filed 2021·Application pending·0 cites
- 3341US2022093683A13d heterogeneous integrated crystalline piezoelectric bulk acoustic resonatorsINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →