Inventor · disambiguated record
Tu-Hao Yu
Also filed as: YU TU-HAO
24 granted patents·6 pending applications·115 citations·filing 2000–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD24WINBOND ELECTRONICS CORP3IND TECH RES INST2TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
30 records- 0197US10867954B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 15, 2020·14 cites·20 claims
- 0297US10720401B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·18 cites·20 claims
- 0394US11978714B2Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·1 cites·18 claims
- 0492US10304800B2Packaging with substrates connected by conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 28, 2019·10 cites·20 claims
- 0591US10510722B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·5 cites·20 claims
- 0690US10170457B2COWOS structures and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·6 cites·20 claims
- 0787US12482753B2Semiconductor device having redistribution layers formed on an active wafer and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 25, 2025·1 cites·20 claims
- 0887US12334464B2Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 0987US10515888B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·4 cites·20 claims
- 1087US7670869B2Semiconductor device and fabrications thereofIND TECH RES INST·Filed 2007·Granted Mar 2, 2010·19 cites·20 claims
- 1186US11476184B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 18, 2022·3 cites·20 claims
- 1286US2025273614A1Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1384US11508696B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 22, 2022·2 cites·20 claims
- 1483US10515869B1Semiconductor package structure having a multi-thermal interface material structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 1583US2025266402A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1679US2024363483A1Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1778US2025347875A1Optical devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1877US12322729B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 1977US12080638B2Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 2077US12062590B2Method for manufacturing semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 13, 2024·1 cites·20 claims
- 2174US11532585B2Package containing device dies and interconnect die and redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 2273US2025208363A1Optical devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2372US11139282B2Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 5, 2021·2 cites·20 claims
- 2471US6906377B2Flash memory cell and fabrication thereofWINBOND ELECTRONICS CORP·Filed 2003·Granted Jun 14, 2005·18 cites·9 claims
- 2559US7138654B2Chemical-mechanical polishing proximity correction method and correction pattern thereofWINBOND ELECTRONICS CORP·Filed 2004·Granted Nov 21, 2006·7 cites·7 claims
- 2655US9406650B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·0 cites·20 claims
- 2752US9806062B2Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·0 cites·20 claims
- 2851US9093489B2Selective curing method of adhesive on substrateTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·0 cites·24 claims
- 2951US6382861B1Cleaning device for cleaning dirt produced from manufacturing equipmentWINBOND ELECTRONICS CORP·Filed 2000·Granted May 7, 2002·2 cites·15 claims
- 3046US2009148980A1Method for forming phase-change memory elementIND TECH RES INST·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →