Inventor · disambiguated record
Ty Mcnutt
Also filed as: MCNUTT TY · MCNUTT TY R · MCNUTT TY RICHARD
14 granted patents·3 pending applications·255 citations·filing 2006–2023
91Inventor score
Files withNORTHROP GRUMMAN SYSTEMS CORP5WOLFSPEED INC4ARKANSAS POWER ELECTRONICS INT INC2CREE FAYETTEVILLE INC2MCNUTT TY R1
Top patents by PatentIndex Score
17 records- 0193US9407251B1Method for reworkable packaging of high speed, low electrical parasitic power electronics modules through gate drive integrationARKANSAS POWER ELECTRONICS INT INC·Filed 2013·Granted Aug 2, 2016·29 cites·4 claims
- 0293US7719055B1Cascode power switch topologiesNORTHROP GRUMMAN SYSTEMS CORP·Filed 2007·Granted May 18, 2010·150 cites·14 claims
- 0391US9095054B1High temperature equalized electrical parasitic power packaging method for many paralleled semiconductor power devicesARKANSAS POWER ELECTRONICS INT INC·Filed 2013·Granted Jul 28, 2015·19 cites·2 claims
- 0487US7982239B2Power switching transistorsNORTHROP GRUMMAN CORP·Filed 2007·Granted Jul 19, 2011·17 cites·10 claims
- 0584US10784235B2Silicon carbide power moduleCREE FAYETTEVILLE INC·Filed 2018·Granted Sep 22, 2020·4 cites·18 claims
- 0681USD954668SHousing for a power module assemblyWOLFSPEED INC·Filed 2019·Granted Jun 14, 2022·19 cites·1 claims
- 0776US7782118B2Gate drive for wide bandgap semiconductor deviceNORTHROP GRUMMAN SYSTEMS CORP·Filed 2007·Granted Aug 24, 2010·11 cites·16 claims
- 0872US7667242B1Systems and methods for maximizing breakdown voltage in semiconductor devicesNORTHROP GRUMMAN SYSTEMS CORP·Filed 2006·Granted Feb 23, 2010·5 cites·8 claims
- 0970US12438097B2Integrated power moduleWOLFSPEED INC·Filed 2023·Granted Oct 7, 2025·0 cites·25 claims
- 1062US11569174B2Integrated power moduleWOLFSPEED INC·Filed 2021·Granted Jan 31, 2023·0 cites·23 claims
- 1157US7800196B2Semiconductor structure with an electric field stop layer for improved edge termination capabilityNORTHROP GRUMMAN SYSTEMS CORP·Filed 2008·Granted Sep 21, 2010·1 cites·16 claims
- 1256USD909310SPower moduleCREE FAYETTEVILLE INC·Filed 2018·Granted Feb 2, 2021·0 cites·1 claims
- 1352US8110494B1Systems and methods for maximizing breakdown voltage in semiconductor devicesVELIADIS JOHN V·Filed 2009·Granted Feb 7, 2012·0 cites·3 claims
- 1449US2022416077A1Power semiconductor die with improved thermal performanceWOLFSPEED INC·Filed 2021·Application pending·0 cites
- 1542US2009179297A1Junction barrier schottky diode with highly-doped channel region and methodsNORTHROP GRUMMAN SYSTEMS CORP·Filed 2008·Application pending·0 cites
- 1639US2008157117A1Insulated gate bipolar transistor with enhanced conductivity modulationMCNUTT TY R·Filed 2006·Application pending·0 cites
- 1738US8278666B1Method and apparatus for growing high purity 2H-silicon carbideSINGH NARSINGH B·Filed 2010·Granted Oct 2, 2012·0 cites·29 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →