Inventor · disambiguated record
Tzu-Hsuan Cheng
Also filed as: CHENG TZU-HSUAN
8 granted patents·1 pending application·6 citations·filing 2016–2025
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0194US11121055B2Leadframe spacer for double-sided power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Sep 14, 2021·4 cites·15 claims
- 0292US12278158B2Leadframe spacer for double-sided power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Apr 15, 2025·1 cites·20 claims
- 0385US11830784B2Leadframe spacer for double-sided power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Nov 28, 2023·1 cites·20 claims
- 0481US12417957B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 0580US2025391728A1Leadframe spacer for double-sided power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0674US11842942B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 12, 2023·0 cites·21 claims
- 0767US11282764B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 0844US10741644B2Semiconductor devices with via structure and package structures comprising the sameDELTA ELECTRONICS INC·Filed 2016·Granted Aug 11, 2020·0 cites·26 claims
- 0941US10056319B2Power module package having patterned insulation metal substrateDELTA ELECTRONICS INC·Filed 2017·Granted Aug 21, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →