Inventor · disambiguated record
Tzu-Jui Fang
Also filed as: FANG TZU-JUI
4 granted patents·3 pending applications·2 citations·filing 2017–2024
61Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0184US2025105077A1Package-on-package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0282US2024387308A1Manufacturing method of package-on-package structure and manufacturing method of integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0373US12198996B2Integrated fan-out package, package-on-package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 0467US10290605B2Fan-out package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·1 cites·16 claims
- 0565US10290590B2Stacked semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·1 cites·18 claims
- 0659US2025038145A1Semiconductor package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0758US11075132B2Integrated fan-out package, package-on-package structure, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →