Inventor · disambiguated record
Tze Yang Hin
Also filed as: HIN TZE Y · HIN TZE YANG
24 granted patents·7 pending applications·62 citations·filing 2005–2023
94Inventor score
Top patents by PatentIndex Score
31 records- 0194US11621173B2Fan out structure for light-emitting diode (LED) device and lighting systemLUMILEDS LLC·Filed 2020·Granted Apr 4, 2023·4 cites·19 claims
- 0294US11373991B2Methods of manufacturing light-emitting devices with metal inlays and bottom contactsLUMILEDS LLC·Filed 2020·Granted Jun 28, 2022·4 cites·20 claims
- 0393US11610935B2Fan-out light-emitting diode (LED) device substrate with embedded backplane, lighting system and method of manufactureLUMILEDS LLC·Filed 2020·Granted Mar 21, 2023·3 cites·20 claims
- 0488US8749056B2Module and method of manufacturing a moduleKEHRER DANIEL·Filed 2011·Granted Jun 10, 2014·11 cites·23 claims
- 0585US11631594B2Fan out structure for light-emitting diode (LED) device and lighting systemLUMILEDS LLC·Filed 2020·Granted Apr 18, 2023·2 cites·12 claims
- 0683US9425174B1Integrated circuit package with solderless interconnection structureALTERA CORP·Filed 2014·Granted Aug 23, 2016·8 cites·4 claims
- 0782US11355548B2Monolithic segmented LED array architectureLUMILEDS LLC·Filed 2018·Granted Jun 7, 2022·3 cites·22 claims
- 0882US8535983B2Method of manufacturing a semiconductor deviceHIN TZE YANG·Filed 2011·Granted Sep 17, 2013·9 cites·7 claims
- 0981US11626448B2Fan-out light-emitting diode (LED) device substrate with embedded backplane, lighting system and method of manufactureLUMILEDS LLC·Filed 2020·Granted Apr 11, 2023·1 cites·17 claims
- 1079US7332823B2Providing a metal layer in a semiconductor packageINTEL CORP·Filed 2005·Granted Feb 19, 2008·14 cites·13 claims
- 1178US12224182B2Fan out structure for light-emitting diode (LED) device and lighting systemLUMILEDS LLC·Filed 2023·Granted Feb 11, 2025·0 cites·19 claims
- 1278US11476217B2Method of manufacturing an augmented LED array assemblyLUMILEDS LLC·Filed 2020·Granted Oct 18, 2022·1 cites·16 claims
- 1374US12051686B2Methods of manufacturing light-emitting devices with metal inlays and bottom contactsLUMILEDS LLC·Filed 2022·Granted Jul 30, 2024·0 cites·20 claims
- 1472US2023163155A1Fan-out light-emitting diode (led) device substrate with embedded backplane, lighting system and method of manufactureLUMILEDS LLC·Filed 2023·Application pending·0 cites
- 1570US12191280B2Ceramic carrier and build up carrier for light-emitting diode (LED) arrayLUMILEDS LLC·Filed 2023·Granted Jan 7, 2025·0 cites·16 claims
- 1670US12132161B2Light-emitting device with metal inlay and top contactsLUMILEDS LLC·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 1770US9691687B2Module and method of manufacturing a moduleINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 27, 2017·2 cites·16 claims
- 1868US12051685B2Light-emitting device with metal inlay and bottom contactsLUMILEDS LLC·Filed 2020·Granted Jul 30, 2024·0 cites·18 claims
- 1967US11156346B2Fan out structure for light-emitting diode (LED) device and lighting systemLUMILEDS LLC·Filed 2020·Granted Oct 26, 2021·0 cites·19 claims
- 2065US11652134B2Monolithic segmented LED array architectureLUMILEDS LLC·Filed 2022·Granted May 16, 2023·0 cites·20 claims
- 2162US11575074B2Light-emitting device with metal inlay and top contactsLUMILEDS LLC·Filed 2020·Granted Feb 7, 2023·0 cites·19 claims
- 2261US11664347B2Ceramic carrier and build up carrier for light-emitting diode (LED) arrayLUMILEDS LLC·Filed 2020·Granted May 30, 2023·0 cites·13 claims
- 2359US11189769B2Light emitting device package with reflective side coatingLUMILEDS LLC·Filed 2019·Granted Nov 30, 2021·0 cites·14 claims
- 2456US2023155073A1Light-emitting diode (led) package with reflective coating and method of manufactureLUMILEDS LLC·Filed 2022·Application pending·0 cites
- 2554US2023156920A1Method Of Manufacturing An Augmented LED Array AssemblyLUMILEDS LLC·Filed 2022·Application pending·0 cites
- 2653US11777066B2Flipchip interconnected light-emitting diode package assemblyLUMILEDS LLC·Filed 2020·Granted Oct 3, 2023·0 cites·9 claims
- 2751US2022190213A1Material stack for leds with a domeLUMILEDS LLC·Filed 2020·Application pending·0 cites
- 2849US10193043B2Light emitting device package with reflective side coatingLUMILEDS LLC·Filed 2017·Granted Jan 29, 2019·0 cites·20 claims
- 2944US2022029050A1Methods of manufacturing a light-emitting device with metal inlay and top contactsLUMILEDS LLC·Filed 2020·Application pending·0 cites
- 3029US2012273935A1Semiconductor Device and Method of Making a Semiconductor DeviceMARTENS STEFAN·Filed 2011·Application pending·0 cites
- 3129US2007152326A1Encapsulated external stiffener for flip chip packageLIM CHIA N·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →