Inventor · disambiguated record
Tzu-Hsuan Hsu
Also filed as: HSU TZU-HSUAN
174 granted patents·35 pending applications·1,230 citations·filing 2003–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD85TAIWAN SEMICONDUCTOR MFG46MACRONIX INT CO LTD39HSU TZU-HSUAN14QUANTA COMP INC8
Top patents by PatentIndex Score
209 records- 0198US11694979B2Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·4 cites·20 claims
- 0298US7450423B2Methods of operating non-volatile memory cells having an oxide/nitride multilayer insulating structureMACRONIX INT CO LTD·Filed 2007·Granted Nov 11, 2008·278 cites·24 claims
- 0397US11221827B1In-memory computation deviceMACRONIX INT CO LTD·Filed 2020·Granted Jan 11, 2022·9 cites·15 claims
- 0497US7999342B2Image sensor element for backside-illuminated sensorTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Aug 16, 2011·44 cites·14 claims
- 0597US6937511B2Circuit and method for programming charge storage memory cellsMACRONIX INT CO LTD·Filed 2004·Granted Aug 30, 2005·143 cites·49 claims
- 0696US10991667B2Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 27, 2021·9 cites·20 claims
- 0796US9620548B1Image sensor with wide contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 11, 2017·14 cites·20 claims
- 0896US7209390B2Operation scheme for spectrum shift in charge trapping non-volatile memoryMACRONIX INT CO LTD·Filed 2004·Granted Apr 24, 2007·111 cites·39 claims
- 0995US9190345B1Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 17, 2015·24 cites·20 claims
- 1095US7811890B2Vertical channel transistor structure and manufacturing method thereofMACRONIX INT CO LTD·Filed 2006·Granted Oct 12, 2010·35 cites·10 claims
- 1194US9711562B2Apparatus and method for reducing optical cross-talk in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 18, 2017·7 cites·20 claims
- 1294US9123615B2Vertically integrated image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 1, 2015·11 cites·20 claims
- 1394US7387907B2Image sensor with optical guard ring and fabrication method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jun 17, 2008·26 cites·11 claims
- 1493US9871070B2Voltage biased metal shielding and deep trench isolation for backside illuminated (BSI) image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·10 cites·20 claims
- 1593US9312294B2Semiconductor devices, methods of manufacturing thereof, and image sensor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 12, 2016·6 cites·20 claims
- 1693US8941204B2Apparatus and method for reducing cross talk in image sensorsLIN JENG-SHYAN·Filed 2012·Granted Jan 27, 2015·10 cites·20 claims
- 1793US2025357399A1Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1892US7242622B2Methods to resolve hard-to-erase condition in charge trapping non-volatile memoryMACRONIX INT CO LTD·Filed 2006·Granted Jul 10, 2007·24 cites·18 claims
- 1992US7078779B2Enhanced color image sensor device and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jul 18, 2006·59 cites·54 claims
- 2091US12310137B2Isolation structure to increase image sensor performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 20, 2025·1 cites·20 claims
- 2191US12289858B2Controlled airflow design for indoor cabinetQUANTA COMP INC·Filed 2023·Granted Apr 29, 2025·1 cites·20 claims
- 2291US9666630B2Semiconductor devices, methods of manufacturing thereof, and image sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·5 cites·20 claims
- 2391US9473753B2Apparatus and method for reducing optical cross-talk in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Oct 18, 2016·7 cites·20 claims
- 2491US9293502B2Semiconductor switching device separated by device isolationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 22, 2016·4 cites·20 claims
- 2591US7656000B2Photodetector for backside-illuminated sensorTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 2, 2010·12 cites·19 claims
- 2690US9455158B23DIC interconnect devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 27, 2016·10 cites·20 claims
- 2790US9041206B2Interconnect structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·11 cites·20 claims
- 2889US12490537B2Image sensor having an improved structure for small pixel designsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 2, 2025·1 cites·20 claims
- 2989US12260130B2Memory device for computing in-memoryMACRONIX INT CO LTD·Filed 2023·Granted Mar 25, 2025·1 cites·20 claims
- 3089US10522586B2Apparatus for reducing optical cross-talk in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·3 cites·20 claims
- 3189US9991307B2Stacked grid design for improved optical performance and isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 5, 2018·5 cites·20 claims
- 3289US7973380B2Method for providing metal extension in backside illuminated sensor for wafer level testingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Jul 5, 2011·18 cites·20 claims
- 3389US7590005B2Program and erase methods with substrate transient hot carrier injections in a non-volatile memoryMACRONIX INT CO LTD·Filed 2007·Granted Sep 15, 2009·16 cites·26 claims
- 3489US2025344538A1Trench isolation structure for scaled pixel regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3588US11477915B2Systems for cooling electronic components in a sealed computer chassisQUANTA COMP INC·Filed 2021·Granted Oct 18, 2022·2 cites·18 claims
- 3688US9966412B2Method for reducing optical cross-talk in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 8, 2018·3 cites·20 claims
- 3788US7638852B2Method of making wafer structure for backside illuminated color image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 29, 2009·13 cites·6 claims
- 3887US12424577B2Isolation structure for bond pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 3987US11069731B2Apparatus for reducing optical cross-talk in image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·20 claims
- 4087US10157959B2Interconnect structure for stacked device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 18, 2018·3 cites·20 claims
- 4186US7838325B2Method to optimize substrate thickness for image sensor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 23, 2010·8 cites·20 claims
- 4286US7485940B2Guard ring structure for improving crosstalk of backside illuminated image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Feb 3, 2009·9 cites·19 claims
- 4385US11335716B2Photosensing pixel, image sensor and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·7 claims
- 4485US9941249B2Multi-wafer stacking by Ox-Ox bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·4 cites·20 claims
- 4585US9865645B2Interconnect structure for stacked device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·3 cites·20 claims
- 4685US9318640B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 19, 2016·6 cites·20 claims
- 4785US8405177B2Method to optimize substrate thickness for image sensor deviceHSU TZU-HSUAN·Filed 2011·Granted Mar 26, 2013·5 cites·20 claims
- 4885US7763927B2Non-volatile memory device having a nitride-oxide dielectric layerMACRONIX INT CO LTD·Filed 2005·Granted Jul 27, 2010·10 cites·18 claims
- 4985US2025366250A1Multi-chip image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5084US10535706B2Interconnect structure for stacked device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·2 cites·20 claims
Showing the top 50 of 209 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Tzu-Hsuan Hsu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →