Inventor · disambiguated record
Tzu-Yun Huang
Also filed as: Huang Tzu-Yun
9 granted patents·4 pending applications·16 citations·filing 2016–2025
80Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7WINBOND ELECTRONICS CORP5NATIONAL YANG MING CHIAO TUNG UNIV1
Top patents by PatentIndex Score
13 records- 0191US10163832B1Integrated fan-out package, redistribution circuit structure, and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·12 cites·19 claims
- 0281US2025386494A1Method for forming non-volatile memory structureWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0381US2025300096A1Integrated Circuit Package and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0473US12347791B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 0573US11004812B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 11, 2021·2 cites·20 claims
- 0672US11387191B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 12, 2022·1 cites·20 claims
- 0769US12432914B2Non-volatile memory structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2022·Granted Sep 30, 2025·0 cites·9 claims
- 0869US10074623B2Method of fabricating redistribution circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 11, 2018·1 cites·20 claims
- 0958US12192661B2Image sensors chip with depth informationNATIONAL YANG MING CHIAO TUNG UNIV·Filed 2023·Granted Jan 7, 2025·0 cites·14 claims
- 1055US2024349499A1Memory device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1150US2025324588A1Memory device and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1249US11362272B2Resistive memory device and reliability enhancement method thereof by using ratio of set current and reference currentWINBOND ELECTRONICS CORP·Filed 2020·Granted Jun 14, 2022·0 cites·14 claims
- 1349US9899342B2Integrated fan-out package, redistribution circuit structure, and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →