Inventor · disambiguated record
Tzung-Hui Lee
Also filed as: LEE TZUNG-HUI
19 granted patents·1 pending application·23 citations·filing 2016–2024
91Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD20
Top patents by PatentIndex Score
20 records- 0189US10510646B2Packae structure, RDL structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·5 cites·20 claims
- 0288US10861814B2Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·5 cites·20 claims
- 0381US11393763B2Integrated fan-out (info) package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·1 cites·20 claims
- 0481US10461023B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·4 cites·20 claims
- 0579US2024371778A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0678US11289373B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·2 cites·20 claims
- 0775US12094830B2Integrated fan-out (InFO) package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·20 claims
- 0875US10297560B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 21, 2019·1 cites·19 claims
- 0974US11410918B2Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 9, 2022·2 cites·20 claims
- 1072US11855014B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 1171US9871009B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·1 cites·20 claims
- 1269US11848233B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 1369US10074623B2Method of fabricating redistribution circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 11, 2018·1 cites·20 claims
- 1468US11842955B2Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 12, 2023·0 cites·20 claims
- 1568US10867793B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·1 cites·20 claims
- 1662US10867941B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 1761US11217518B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 4, 2022·0 cites·20 claims
- 1857US11289410B2Integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·0 cites·20 claims
- 1949US11398416B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 26, 2022·0 cites·20 claims
- 2049US9899342B2Integrated fan-out package, redistribution circuit structure, and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →