Inventor · disambiguated record
Tzy-Ying Lin
Also filed as: LIN TZY-YING
13 granted patents·4 pending applications·172 citations·filing 1995–2011
92Inventor score
Top patents by PatentIndex Score
17 records- 0195US7569409B2Isolation structures for CMOS image sensor chip scale packagesVISERA TECHNOLOGIES CO LTD·Filed 2007·Granted Aug 4, 2009·36 cites·14 claims
- 0287US7928655B2Light-emitting diode device and method for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Apr 19, 2011·17 cites·8 claims
- 0387US7433555B2Optoelectronic device chip having a composite spacer structure and method making sameVISERA TECHNOLOGIES CO LTD·Filed 2006·Granted Oct 7, 2008·16 cites·7 claims
- 0484US8388793B1Method for fabricating camera moduleLIN TZY-YING·Filed 2011·Granted Mar 5, 2013·5 cites·16 claims
- 0581US7932529B2Light-emitting diode device and method for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Apr 26, 2011·11 cites·11 claims
- 0677US5471552AFabrication of static-alignment fiber-guiding grooves for planar lightwave circuitsIND TECH RES INST·Filed 1995·Granted Nov 28, 1995·52 cites·20 claims
- 0773US8059341B2Lens assembly and method for forming the sameLIN TZY-YING·Filed 2009·Granted Nov 15, 2011·3 cites·18 claims
- 0873US7860357B2Optoelectronic device chip having a composite spacer structure and method making sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Granted Dec 28, 2010·5 cites·7 claims
- 0970US8138509B2Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrateLIN TZY-YING·Filed 2009·Granted Mar 20, 2012·5 cites·11 claims
- 1068US7833810B2Method of fabricating isolation structures for CMOS image sensor chip scale packagesVISERA TECHNOLOGIES CO LTD·Filed 2009·Granted Nov 16, 2010·3 cites·8 claims
- 1151US6555277B1Quartz damage repair method for high-end maskTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Apr 29, 2003·4 cites·40 claims
- 1247US6841311B1Cleaning process for phase shift masksTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jan 11, 2005·4 cites·33 claims
- 1347US2012024347A1Solar package structure and method for fabricating the sameLIN TZY-YING·Filed 2010·Application pending·0 cites
- 1445US2011292271A1Camera module and fabrication method thereofLIN TZY-YING·Filed 2010·Application pending·0 cites
- 1541US2013141917A1Led light deviceLIN TZY-YING·Filed 2011·Application pending·0 cites
- 1639US6309976B1Critical dimension controlled method of plasma descum for conventional quarter micron and smaller dimension binary mask manufactureTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Oct 30, 2001·11 cites·24 claims
- 1733US2004224237A1Whole new mask repair methodTAIWAN SEMICONDUCTOR MFG·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →