Inventor · disambiguated record
Tzu-Hung Lin
Also filed as: LIN TZU-HUNG
100 granted patents·29 pending applications·264 citations·filing 2011–2024
99Inventor score
Files withMEDIATEK INC100UNIV NAT TAIPEI TECHNOLOGY16LIN TZU-HUNG6GREGORICH THOMAS MATTHEW3CHAN KUEI-TI1
Top patents by PatentIndex Score
129 records- 0198US11410936B2Semiconductor package structureMEDIATEK INC·Filed 2020·Granted Aug 9, 2022·7 cites·10 claims
- 0296US9548289B2Semiconductor package assemblies with system-on-chip (SOC) packagesMEDIATEK INC·Filed 2015·Granted Jan 17, 2017·15 cites·22 claims
- 0395US9786632B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2016·Granted Oct 10, 2017·11 cites·32 claims
- 0494US9704836B2Semiconductor package assemblyMEDIATEK INC·Filed 2016·Granted Jul 11, 2017·11 cites·41 claims
- 0593US11742564B2Fan-out package structure with integrated antennaMEDIATEK INC·Filed 2021·Granted Aug 29, 2023·2 cites·5 claims
- 0693US11574881B2Semiconductor package structure with antennaMEDIATEK INC·Filed 2021·Granted Feb 7, 2023·2 cites·13 claims
- 0792US11948895B2Semiconductor package structureMEDIATEK INC·Filed 2022·Granted Apr 2, 2024·1 cites·9 claims
- 0891US11081453B2Semiconductor package structure with antennaMEDIATEK INC·Filed 2019·Granted Aug 3, 2021·6 cites·16 claims
- 0991US10784211B2Semiconductor package structureMEDIATEK INC·Filed 2018·Granted Sep 22, 2020·5 cites·20 claims
- 1091US10483211B2Fan-out package structure and method for forming the sameMEDIATEK INC·Filed 2017·Granted Nov 19, 2019·8 cites·28 claims
- 1191US10217724B2Semiconductor package assembly with embedded IPDMEDIATEK INC·Filed 2016·Granted Feb 26, 2019·8 cites·25 claims
- 1291US10109608B2Semiconductor packageMEDIATEK INC·Filed 2016·Granted Oct 23, 2018·7 cites·19 claims
- 1391US10079192B2Semiconductor chip package assembly with improved heat dissipation performanceMEDIATEK INC·Filed 2016·Granted Sep 18, 2018·8 cites·15 claims
- 1491US10032756B2Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the sameMEDIATEK INC·Filed 2016·Granted Jul 24, 2018·7 cites·22 claims
- 1591US9570399B2Semiconductor package assembly with through silicon via interconnectMEDIATEK INC·Filed 2015·Granted Feb 14, 2017·9 cites·18 claims
- 1690US10553526B2Semiconductor packageMEDIATEK INC·Filed 2017·Granted Feb 4, 2020·5 cites·21 claims
- 1789US11387176B2Semiconductor package structureMEDIATEK INC·Filed 2020·Granted Jul 12, 2022·2 cites·21 claims
- 1889US11362044B2Semiconductor package structureMEDIATEK INC·Filed 2020·Granted Jun 14, 2022·3 cites·9 claims
- 1989US11043730B2Fan-out package structure with integrated antennaMEDIATEK INC·Filed 2019·Granted Jun 22, 2021·5 cites·19 claims
- 2089US10692789B2Stacked fan-out package structureMEDIATEK INC·Filed 2018·Granted Jun 23, 2020·5 cites·15 claims
- 2188US11652273B2Innovative air gap for antenna fan out packageMEDIATEK INC·Filed 2022·Granted May 16, 2023·1 cites·17 claims
- 2288US10573616B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2016·Granted Feb 25, 2020·4 cites·26 claims
- 2388US10424563B2Semiconductor package assembly and method for forming the sameMEDIATEK INC·Filed 2016·Granted Sep 24, 2019·5 cites·29 claims
- 2487US11646295B2Semiconductor package structure having an annular frame with truncated cornersMEDIATEK INC·Filed 2021·Granted May 9, 2023·1 cites·18 claims
- 2587US11024954B2Semiconductor package with antenna and fabrication method thereofMEDIATEK INC·Filed 2019·Granted Jun 1, 2021·5 cites·25 claims
- 2687US9177899B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2012·Granted Nov 3, 2015·9 cites·8 claims
- 2787US8633588B2Semiconductor packageLIN TZU-HUNG·Filed 2011·Granted Jan 21, 2014·8 cites·20 claims
- 2887US8390119B2Flip chip package utilizing trace bump trace interconnectionLIN TZU-HUNG·Filed 2011·Granted Mar 5, 2013·7 cites·20 claims
- 2986US11171113B2Semiconductor package structure having an annular frame with truncated cornersMEDIATEK INC·Filed 2019·Granted Nov 9, 2021·3 cites·17 claims
- 3086US9607951B2Chip packageMEDIATEK SINGAPORE PTE LTD·Filed 2013·Granted Mar 28, 2017·8 cites·16 claims
- 3186US9543232B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2015·Granted Jan 10, 2017·4 cites·18 claims
- 3285US9711488B2Semiconductor package assemblyMEDIATEK INC·Filed 2016·Granted Jul 18, 2017·4 cites·23 claims
- 3384US11450606B2Chip scale package structure and method of forming the sameMEDIATEK INC·Filed 2019·Granted Sep 20, 2022·3 cites·11 claims
- 3484US9142526B2Semiconductor package with solder resist capped trace to prevent underfill delaminationMEDIATEK INC·Filed 2013·Granted Sep 22, 2015·5 cites·20 claims
- 3582US11121108B2Flip chip package utilizing trace bump trace interconnectionMEDIATEK INC·Filed 2020·Granted Sep 14, 2021·1 cites·21 claims
- 3682US10361173B2Semiconductor package assemblies with system-on-chip (SOC) packagesMEDIATEK INC·Filed 2016·Granted Jul 23, 2019·3 cites·18 claims
- 3781US11508678B2Semiconductor package structure including antennaMEDIATEK INC·Filed 2020·Granted Nov 22, 2022·1 cites·20 claims
- 3881US9640505B2Semiconductor package with trace covered by solder resistMEDIATEK INC·Filed 2015·Granted May 2, 2017·3 cites·18 claims
- 3980US11728292B2Semiconductor package assembly having a conductive electromagnetic shield layerMEDIATEK INC·Filed 2020·Granted Aug 15, 2023·1 cites·18 claims
- 4080US11264337B2Semiconductor package structureMEDIATEK INC·Filed 2019·Granted Mar 1, 2022·2 cites·18 claims
- 4179US12142598B2Semiconductor package structure having an annular frame with truncated cornersMEDIATEK INC·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 4279US9978729B2Semiconductor package assemblyMEDIATEK INC·Filed 2015·Granted May 22, 2018·3 cites·30 claims
- 4379US9553040B2Semiconductor packageMEDIATEK INC·Filed 2013·Granted Jan 24, 2017·3 cites·26 claims
- 4479US9520349B2Semiconductor packageMEDIATEK INC·Filed 2015·Granted Dec 13, 2016·2 cites·20 claims
- 4578US10497689B2Semiconductor package assembly and method for forming the sameMEDIATEK INC·Filed 2018·Granted Dec 3, 2019·2 cites·20 claims
- 4677US10580747B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2014·Granted Mar 3, 2020·2 cites·21 claims
- 4777US10573615B2Semiconductor package and method for fabricating base for semiconductor packageMEDIATEK INC·Filed 2014·Granted Feb 25, 2020·2 cites·21 claims
- 4877US10177125B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Jan 8, 2019·2 cites·20 claims
- 4977US9437512B2Integrated circuit package structureGREGORICH THOMAS MATTHEW·Filed 2012·Granted Sep 6, 2016·5 cites·9 claims
- 5077US8987897B2Semiconductor packageCHAN KUEI-TI·Filed 2011·Granted Mar 24, 2015·5 cites·24 claims
Showing the top 50 of 129 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →