Inventor · disambiguated record
Tzuan-Horng Liu
Also filed as: LIU TZUAN-HORNG
105 granted patents·42 pending applications·445 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD128TAIWAN SEMICONDUCTOR MFG7LIU TZUAN-HORNG3CHEN CHIH-HUA1CHEN HSIEN-WEI1
Top patents by PatentIndex Score
147 records- 0199US11658069B2Method for manufacturing a semiconductor device having an interconnect structure over a substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·9 cites·20 claims
- 0299US11233035B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 25, 2022·8 cites·20 claims
- 0399US10510650B2Method of manufacturing semiconductor device packaging structure having through interposer vias and through substrate viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·67 cites·20 claims
- 0498US12132024B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 29, 2024·4 cites·20 claims
- 0598US11908692B2Method for fabricating a chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·4 cites·20 claims
- 0698US11742297B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·4 cites·20 claims
- 0798US11502062B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 15, 2022·12 cites·20 claims
- 0898US11456240B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 0998US9128123B2Interposer test structures and methodsLIU TZUAN-HORNG·Filed 2011·Granted Sep 8, 2015·31 cites·20 claims
- 1097US12199024B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 14, 2025·2 cites·20 claims
- 1197US11854921B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·4 cites·20 claims
- 1297US11587894B2Package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·12 cites·20 claims
- 1397US11417629B2Three-dimensional stacking structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 16, 2022·4 cites·16 claims
- 1497US9589857B2Interposer test structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 7, 2017·8 cites·20 claims
- 1596US11380653B2Die stack structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·3 cites·20 claims
- 1696US11164848B2Semiconductor structure and method manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 2, 2021·6 cites·20 claims
- 1796US10867879B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·13 cites·20 claims
- 1896US10468379B13DIC structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 5, 2019·13 cites·20 claims
- 1996US8896094B2Methods and apparatus for inductors and transformers in packagesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 25, 2014·28 cites·17 claims
- 2096US8283781B2Semiconductor device having pad structure with stress buffer layerWU WEI-CHENG·Filed 2010·Granted Oct 9, 2012·33 cites·20 claims
- 2195US11916012B2Manufacturing method of semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·2 cites·20 claims
- 2295US11264362B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·3 cites·15 claims
- 2395US11024605B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·11 cites·20 claims
- 2494US11784163B2Stacking structure, package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 10, 2023·2 cites·20 claims
- 2594US10756010B2Semiconductor device packaging structure having through interposer vias and through substrate viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·6 cites·20 claims
- 2694US10510691B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·9 cites·20 claims
- 2794US10483174B1Integrated circuit component and package structure having the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·7 cites·13 claims
- 2894US8558229B2Passivation layer for packaged chipJENG SHIN-PUU·Filed 2011·Granted Oct 15, 2013·19 cites·20 claims
- 2993US11069608B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·6 cites·20 claims
- 3092US12154875B2Package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·1 cites·20 claims
- 3192US11443995B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·2 cites·20 claims
- 3292US11056438B2Semiconductor packages and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·5 cites·20 claims
- 3391US12057438B2Die stack structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·1 cites·20 claims
- 3491US11322477B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 3591US10090213B2Interposer test structures and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 2, 2018·3 cites·20 claims
- 3691US9570366B2Passivation layer for packaged chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 14, 2017·11 cites·20 claims
- 3790US11114413B2Stacking structure, package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 7, 2021·5 cites·20 claims
- 3889US11562983B2Package having multiple chips integrated therein and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 24, 2023·2 cites·20 claims
- 3989US8659170B2Semiconductor device having conductive pads and a method of manufacturing the sameKUO CHEN-CHENG·Filed 2010·Granted Feb 25, 2014·9 cites·21 claims
- 4088US12406965B2PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 4188US8434041B2Increasing dielectric strength by optimizing dummy metal distributionCHEN HSIEN-WEI·Filed 2011·Granted Apr 30, 2013·10 cites·20 claims
- 4288US2025336892A1PackageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4387US11916025B2Device die and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·1 cites·20 claims
- 4487US10978410B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·3 cites·20 claims
- 4587US8193639B2Dummy metal design for packaging structuresLIU TZUAN-HORNG·Filed 2010·Granted Jun 5, 2012·8 cites·20 claims
- 4687US2025357273A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4786US12355008B2Methods of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 4886US10867929B2Semiconductor structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 4986US8669651B2Package-on-package structures with reduced bump bridgingYANG CHUNG-YING·Filed 2010·Granted Mar 11, 2014·9 cites·15 claims
- 5086US2025349778A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 147 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →