Inventor · disambiguated record
Tzu-Ting Liu
Also filed as: LIU TZU-TING
1 granted patent·9 pending applications·0 citations·filing 2022–2025
11Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10
Top patents by PatentIndex Score
10 records- 0173US2025357309A1Structure and Method for Three-Dimensional Capacitor with Enhanced Packaging Density and Reduced WarpageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0272US2025349627A1Sacrificial test padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0369US2025253230A1Structure and Method for Three-Dimensional Capacitor with Enhanced Packaging Density and Reduced WarpageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0466US2025132208A1Sacrificial test padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0558US12310252B2Semiconductor memory structure and method for forming the semiconductor memory structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 0654US2025324619A1Metal-insulator-metal capacitor, semiconductor device having the same and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0754US2025118654A1Embedding a metal-insulator-metal capacitor in a passivation layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0853US2025015007A1Via array in a redistribution layer structure for stress reliefTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0951US2024088208A1Semiconductor device structure with metal oxide layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1051US2024145378A1Via with sacrificial stress barrier ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →