Inventor · disambiguated record
Tzu-Hsuan Ni
Also filed as: NI TZU-HSUAN
6 granted patents·4 citations·filing 2020–2023
70Inventor score
Files withIND TECH RES INST6
Top patents by PatentIndex Score
6 records- 0187US11424190B2Multi-chip package and manufacture method thereofIND TECH RES INST·Filed 2020·Granted Aug 23, 2022·2 cites·20 claims
- 0286US11251174B2Image sensor package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted Feb 15, 2022·2 cites·16 claims
- 0370US11569217B2Image sensor package and manufacturing method thereofIND TECH RES INST·Filed 2022·Granted Jan 31, 2023·0 cites·3 claims
- 0467US12074137B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2023·Granted Aug 27, 2024·0 cites·11 claims
- 0558US11587905B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted Feb 21, 2023·0 cites·8 claims
- 0654US11646270B2Multi-chip package and manufacturing method thereofIND TECH RES INST·Filed 2020·Granted May 9, 2023·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →