Inventor · disambiguated record
Tzu-Ming Ou Yang
Also filed as: OU YANG TZU-MING
25 granted patents·11 pending applications·7 citations·filing 2018–2025
91Inventor score
Files withWINBOND ELECTRONICS CORP36
Top patents by PatentIndex Score
36 records- 0179US11664438B2Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted May 30, 2023·2 cites·18 claims
- 0279US10797057B2DRAM semiconductor device having reduced parasitic capacitance between capacitor contacts and bit line structures and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Oct 6, 2020·2 cites·14 claims
- 0377US11417666B2Dynamic random access memory and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Aug 16, 2022·1 cites·8 claims
- 0474US10593676B2Memory device and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2018·Granted Mar 17, 2020·2 cites·18 claims
- 0572US12206010B2Method for forming a semiconductor structureWINBOND ELECTRONICS CORP·Filed 2023·Granted Jan 21, 2025·0 cites·19 claims
- 0671US12262528B2Manufacturing method of memory structureWINBOND ELECTRONICS CORP·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 0767US12193214B2Manufacturing method for memory structureWINBOND ELECTRONICS CORP·Filed 2022·Granted Jan 7, 2025·0 cites·19 claims
- 0865US11631642B2Method for manufacturing semiconductor deviceWINBOND ELECTRONICS CORP·Filed 2021·Granted Apr 18, 2023·0 cites·14 claims
- 0965US11527537B2Memory structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2021·Granted Dec 13, 2022·0 cites·7 claims
- 1065US2025266349A1Semiconductor memory structureWINBOND ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1164US11610897B2Landing pad structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Mar 21, 2023·0 cites·10 claims
- 1264US11404422B2DRAM semiconductor device having reduced parasitic capacitance between capacitor contacts and bit line structures and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Aug 2, 2022·0 cites·13 claims
- 1363US12144165B2Dynamic random access memory having word line buried in chop structure with different widthsWINBOND ELECTRONICS CORP·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 1461US11342332B2Memory structure and manufacturing method thereforWINBOND ELECTRONICS CORP·Filed 2020·Granted May 24, 2022·0 cites·19 claims
- 1561US11217527B2Semiconductor device and manufacturing method of the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Jan 4, 2022·0 cites·7 claims
- 1661US2025227922A1Semiconductor device and formation method thereofWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1760US11557595B2Memory deviceWINBOND ELECTRONICS CORP·Filed 2020·Granted Jan 17, 2023·0 cites·11 claims
- 1860US2025048620A1Memory device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1959US12322698B2Semiconductor memory structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 3, 2025·0 cites·18 claims
- 2059US2025351344A1Semiconductor device and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2158US2025167124A1Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 2255US11011525B2Landing pad structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted May 18, 2021·0 cites·7 claims
- 2355US10847380B2Semiconductor device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2020·Granted Nov 24, 2020·0 cites·11 claims
- 2455US2024170296A1Method for forming semiconductor structure and semiconductor structureWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2554US10756099B2Memory device and method for manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted Aug 25, 2020·0 cites·8 claims
- 2654US2024212988A1Dry etching methods for reducing fluorocarbon-containing gas emissionsWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2753US12408320B2Semiconductor structure and method of manufacturing the sameWINBOND ELECTRONICS CORP·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 2853US2023389300A1Memory device and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 2951US10665471B2Semiconductor device and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted May 26, 2020·0 cites·7 claims
- 3051US2024179889A1Memory device and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 3151US2024164087A1Semiconductor structure and method of forming the sameWINBOND ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3248US11289493B2Patterning methodWINBOND ELECTRONICS CORP·Filed 2019·Granted Mar 29, 2022·0 cites·14 claims
- 3344US11683926B2Method of manufacturing semiconductor structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 20, 2023·0 cites·14 claims
- 3443US11527475B2Memory devices and methods for forming the sameWINBOND ELECTRONICS CORP·Filed 2020·Granted Dec 13, 2022·0 cites·15 claims
- 3537US10985262B2Semiconductor structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2018·Granted Apr 20, 2021·0 cites·16 claims
- 3636US2019334084A1Resistive random access memory structure and manufacturing method thereofWINBOND ELECTRONICS CORP·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →