Inventor · disambiguated record
Tzu-Chieh Shen
Also filed as: SHEN TZU-CHIEH
15 granted patents·12 pending applications·5 citations·filing 2013–2024
85Inventor score
Top patents by PatentIndex Score
27 records- 0185US11511870B2Parachute device for drone and method for opening parachute thereofIND TECH RES INST·Filed 2020·Granted Nov 29, 2022·2 cites·18 claims
- 0269US10141266B2Method of fabricating semiconductor package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Nov 27, 2018·1 cites·20 claims
- 0363US9716060B2Package structure with an embedded electronic component and method of fabricating the package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jul 25, 2017·1 cites·12 claims
- 0460US9673140B2Package structure having a laminated release layer and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·1 cites·9 claims
- 0557US9510463B2Coreless packaging substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 29, 2016·0 cites·9 claims
- 0656US2025199937A1Anomaly detection device and method thereofIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0753US2017171981A1Method of fabricating substrate structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Application pending·0 cites
- 0852US10068842B2Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Sep 4, 2018·0 cites·13 claims
- 0952US10002825B2Method of fabricating package structure with an embedded electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 19, 2018·0 cites·23 claims
- 1052US2016013123A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 1151US9899249B2Fabrication method of coreless packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·10 claims
- 1250US9735080B2Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 15, 2017·0 cites·8 claims
- 1350US9594572B2Electronic apparatus and method for resuming from hibernationIND TECH RES INST·Filed 2014·Granted Mar 14, 2017·0 cites·18 claims
- 1449US10043757B2Semiconductor package structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·10 claims
- 1549US9905438B2Method of manufacturing package substrate and semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 27, 2018·0 cites·13 claims
- 1649US9640503B2Package substrate, semiconductor package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 2, 2017·0 cites·17 claims
- 1749US2016081186A1Substrate structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 1849US2018247891A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 1948US2017301658A1Fabrication method of package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2044US2015325516A1Coreless packaging substrate, pop structure, and methods for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2144US2015333029A1Package substrate and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2243US2016071780A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2342US2015102484A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2441US9785448B2System suspending method, system resuming method and computer system using the sameIND TECH RES INST·Filed 2015·Granted Oct 10, 2017·0 cites·20 claims
- 2535US11372779B2Memory controller and memory page management methodIND TECH RES INST·Filed 2019·Granted Jun 28, 2022·0 cites·20 claims
- 2635US2017168852A1Method for initializing peripheral devices and electronic device using the sameIND TECH RES INST·Filed 2016·Application pending·0 cites
- 2733US2016086879A1Package substrate and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →