Inventor · disambiguated record
Tzu-Shiun Sheu
Also filed as: SHEU TZU-SHIUN
7 granted patents·2 pending applications·25 citations·filing 2013–2024
78Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD9
Top patents by PatentIndex Score
9 records- 0195US9812426B1Integrated fan-out package, semiconductor device, and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·19 cites·20 claims
- 0286US9524942B2Chip-on-substrate packaging on carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 20, 2016·6 cites·20 claims
- 0373US12176299B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0462US10679951B2Chip-on-substrate packaging on carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·20 claims
- 0561US11587887B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 0659US10163822B2Chip-on-substrate packaging on carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·0 cites·20 claims
- 0759US2025372534A1Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0858US2025201747A1Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0956US9922943B2Chip-on-substrate packaging on carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →