Inventor · disambiguated record
Tzu-Chun Tang
Also filed as: TANG TZU-CHUN
34 granted patents·9 pending applications·134 citations·filing 2012–2025
96Inventor score
Top patents by PatentIndex Score
43 records- 0199US11587916B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 21, 2023·8 cites·20 claims
- 0298US10157834B1Electronic apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·24 cites·20 claims
- 0397US10777518B1Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·19 cites·20 claims
- 0496US10867938B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·16 cites·20 claims
- 0595US11450628B2Package structure including a solenoid inductor laterally aside a die and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·4 cites·20 claims
- 0694US12094860B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·1 cites·20 claims
- 0793US10672728B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·6 cites·20 claims
- 0893US10366966B1Method of manufacturing integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 30, 2019·8 cites·20 claims
- 0991US10868353B2Electronic device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·7 cites·9 claims
- 1090US11348886B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·2 cites·20 claims
- 1190US10043761B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 7, 2018·5 cites·20 claims
- 1289US10510714B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·20 claims
- 1388US10050013B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 14, 2018·5 cites·20 claims
- 1487US12033963B2Package structure comprising thermally conductive layer around the IC dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·1 cites·20 claims
- 1586US2025349819A1Method and structure for 3dic power distributionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1685US12334457B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 1785US11854928B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·1 cites·20 claims
- 1885US10128203B2Fan-out package structure, antenna system and associated methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·4 cites·18 claims
- 1984US2024387367A1Method of manufacturing electronic apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2083US11171088B2Electronic apparatus including antennas and directorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 9, 2021·2 cites·20 claims
- 2183US2024371842A1Manufacturing method of package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2282US11211358B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·20 claims
- 2382US10304614B2Stacked coil for wireless charging structure on InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 28, 2019·2 cites·20 claims
- 2482US2024258287A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2580US2024387502A1Method and structure for 3dic power distributionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2678US11929333B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·20 claims
- 2778US9601439B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 21, 2017·3 cites·20 claims
- 2878US9059519B2MIMO antenna device, antenna and antenna packageLIN KEN-HUANG·Filed 2012·Granted Jun 16, 2015·6 cites·12 claims
- 2977US10510681B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 3075US12136593B2Electronic apparatus including antennas and directorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 3175US2024321786A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3274US11335767B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 17, 2022·2 cites·20 claims
- 3374US10756052B2Method of manufacturing integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 25, 2020·1 cites·20 claims
- 3470US11282810B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 3569US2023154913A1Method and structure for 3dic power distributionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3667US11211339B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
- 3765US10825602B2Stacked coil for wireless charging structure on InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 3864US12512405B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 30, 2025·0 cites·20 claims
- 3963US10510478B2Stacked coil for wireless charging structure on InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 17, 2019·0 cites·20 claims
- 4063US2025372560A1Semiconductor die, semiconductor package and method for manufacturing semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4161US2025253292A1Chip package structure with conductive via structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4256US10269481B2Stacked coil for wireless charging structure on InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 23, 2019·0 cites·20 claims
- 4347US9312608B2Multiple-input multiple-output antenna deviceTAI SAW TECHNOLOGY CO LTD·Filed 2013·Granted Apr 12, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →