Inventor · disambiguated record
Tzu-Yi Tien
Also filed as: TIEN TZU-YI
3 granted patents·397 citations·filing 2001–2002
80Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD3
Top patents by PatentIndex Score
3 records- 0194US6472741B1Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 29, 2002·230 cites·18 claims
- 0291US6716676B2Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Apr 6, 2004·91 cites·9 claims
- 0391US6400014B1Semiconductor package with a heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jun 4, 2002·76 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →