Inventor · disambiguated record
Tzu-Ching Tsai
Also filed as: TSAI TZU-CHING
69 granted patents·11 pending applications·351 citations·filing 1998–2025
98Inventor score
Files withNANYA TECHNOLOGY CORP55HON HAI PREC IND CO LTD10TSAI TZU-CHING5CONCRAFT HOLDING CO LTD4MICROSOFT CORP4
Top patents by PatentIndex Score
80 records- 0197US12183643B2Implanting system for fabricating semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Dec 31, 2024·4 cites·12 claims
- 0297US11309263B2Semiconductor device structure with air gap structure and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Apr 19, 2022·4 cites·20 claims
- 0394US8292635B2Connector assembly with robust latching meansLITTLE TERRANCE F·Filed 2011·Granted Oct 23, 2012·39 cites·17 claims
- 0488USD587209SElectrical connectorHON HAI PREC IND CO LTD·Filed 2008·Granted Feb 24, 2009·37 cites·1 claims
- 0585US7736177B2Electrical connector having improved contacts thereinHON HAI PREC IND CO LTD·Filed 2008·Granted Jun 15, 2010·23 cites·5 claims
- 0684US7988473B2Electrical card connector having a shield assisting in retaining an inserted card to a sliderHON HAI PREC IND CO LTD·Filed 2010·Granted Aug 2, 2011·6 cites·13 claims
- 0783US7878858B1N-in-1 card connectorHON HAI PREC IND CO LTD·Filed 2010·Granted Feb 1, 2011·7 cites·14 claims
- 0882US12308288B2Semiconductor device with composite conductive features and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2024·Granted May 20, 2025·0 cites·12 claims
- 0982US12278140B2Semiconductor device with composite conductive features and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2024·Granted Apr 15, 2025·0 cites·7 claims
- 1082US7982315B2Semiconductor structure and method of making the sameNANYA TECHNOLOGY CORP·Filed 2008·Granted Jul 19, 2011·10 cites·11 claims
- 1181US8133067B2Electrical connector with locking engagement between an actuator and an insulative housingTSAI TZU-CHING·Filed 2010·Granted Mar 13, 2012·13 cites·17 claims
- 1279US11315871B2Integrated circuit device with bonding structure and method of forming the sameNANYA TECHNOLOGY CORP·Filed 2019·Granted Apr 26, 2022·2 cites·7 claims
- 1379US7341952B2Multi-layer hard mask structure for etching deep trench in substrateNANYA TECHNOLOGY CORP·Filed 2006·Granted Mar 11, 2008·6 cites·14 claims
- 1478US7980870B2Electrical card connectorHON HAI PREC IND CO LTD·Filed 2010·Granted Jul 19, 2011·5 cites·9 claims
- 1577US8246366B2Electrical card connector with a stop member for temporarily preventing a card from ejecting from the card release positionTSAI TZU-CHING·Filed 2011·Granted Aug 21, 2012·5 cites·20 claims
- 1677US6800535B1Method for forming bottle-shaped trenchesNANYA TECHNOLOGY CORP·Filed 2003·Granted Oct 5, 2004·17 cites·27 claims
- 1777US2025300022A1Deposition method for fabricating semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1876US6767800B1Process for integrating alignment mark and trench deviceNANYA TECHNOLOGY CORP·Filed 2003·Granted Jul 27, 2004·20 cites·17 claims
- 1975US2025270688A1Deposition system for fabricating semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 2074US12159831B2Method of manufacturing integrated circuit device with bonding structureNANYA TECHNOLOGY CORP·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 2173US12125744B2Semiconductor device with composite conductive features and method for preparing the sameNANYA TECHNOLOGY CORP·Filed 2022·Granted Oct 22, 2024·0 cites·13 claims
- 2273US8251723B2Interconnection system incorporated with magnetic arrangementTSAI TZU-CHING·Filed 2010·Granted Aug 28, 2012·8 cites·15 claims
- 2373US6541347B2Method of providing planarity of a photoresistNANYA TECHNOLOGY CORP·Filed 2000·Granted Apr 1, 2003·13 cites·8 claims
- 2472US6815307B1Method for fabricating a deep trench capacitorNANYA TECHNOLOGY CORP·Filed 2003·Granted Nov 9, 2004·17 cites·9 claims
- 2572US6696344B1Method for forming a bottle-shaped trenchNANYA TECHNOLOGY CORP·Filed 2003·Granted Feb 24, 2004·13 cites·15 claims
- 2671US12326714B2Method for controlling etching toolNANYA TECHNOLOGY CORP·Filed 2022·Granted Jun 10, 2025·0 cites·9 claims
- 2770US12421595B2Deposition system for fabricating semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Sep 23, 2025·0 cites·10 claims
- 2869US11764148B2Method of forming integrated circuit device with bonding structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Sep 19, 2023·0 cites·5 claims
- 2969US2025181059A1Method for controlling etching toolNANYA TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 3067US2023420307A1Deposition method for fabricating semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 3165US11527493B2Method for preparing semiconductor device structure with air gap structureNANYA TECHNOLOGY CORP·Filed 2021·Granted Dec 13, 2022·0 cites·18 claims
- 3264US6852590B1Deep trench capacitor and method of fabricating the sameNANYA TECHNOLOGY CORP·Filed 2004·Granted Feb 8, 2005·10 cites·11 claims
- 3359US12412755B2Etching system for fabricating semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2022·Granted Sep 9, 2025·0 cites·12 claims
- 3459US11758712B1Manufacturing method of memory device having bit line with stepped profileNANYA TECHNOLOGY CORP·Filed 2022·Granted Sep 12, 2023·0 cites·19 claims
- 3558US12022649B2Memory device having bit line with stepped profileNANYA TECHNOLOGY CORP·Filed 2022·Granted Jun 25, 2024·0 cites·19 claims
- 3658US6815356B2Method for forming bottle trenchNANYA TECHNOLOGY CORP·Filed 2003·Granted Nov 9, 2004·8 cites·18 claims
- 3757US12314032B2Method for controlling deposition toolNANYA TECHNOLOGY CORP·Filed 2022·Granted May 27, 2025·0 cites·9 claims
- 3855US7500879B2Electrical card connectorHON HAI PREC IND CO LTD·Filed 2007·Granted Mar 10, 2009·4 cites·18 claims
- 3955US7029753B2Multi-layer hard mask structure for etching deep trench in substrateNANYA TECHNOLOGY CORP·Filed 2003·Granted Apr 18, 2006·4 cites·6 claims
- 4055US6964926B2Method of forming geometric deep trench capacitorsNANYA TECHNOLOGY CORP·Filed 2003·Granted Nov 15, 2005·6 cites·24 claims
- 4155US6383936B1Method for removing black silicon in semiconductor fabricationNANYA TECHNOLOGY CORP·Filed 2001·Granted May 7, 2002·6 cites·5 claims
- 4254US2023420306A1Implanting method for fabricating semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 4354US2023418259A1Etching method for fabricating semiconductor device structureNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 4454US2023360978A1Method for controlling implanting toolNANYA TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 4553US7026207B2Method of filling bit line contact viaNANYA TECHNOLOGY CORP·Filed 2003·Granted Apr 11, 2006·5 cites·1 claims
- 4652US11264474B1Semiconductor device with boron nitride layer and method for fabricating the sameNANYA TECHNOLOGY CORP·Filed 2020·Granted Mar 1, 2022·0 cites·14 claims
- 4752US6946344B2Method for forming trench capacitorNANYA TECHNOLOGY CORP·Filed 2003·Granted Sep 20, 2005·5 cites·21 claims
- 4851US10705264B2Varifocal lens moduleCONCRAFT HOLDING CO LTD·Filed 2018·Granted Jul 7, 2020·0 cites·10 claims
- 4951USD587208SElectrical connectorHON HAI PREC IND CO LTD·Filed 2008·Granted Feb 24, 2009·7 cites·1 claims
- 5051US6709975B2Method of forming inter-metal dielectricNANYA TECHNOLOGY CORP·Filed 2002·Granted Mar 23, 2004·4 cites·20 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →