Inventor · disambiguated record

Tzu-Chung Tsai

Also filed as: TSAI TZU-CHUNG

28 granted patents·11 pending applications·38 citations·filing 2018–2025

94Inventor score

Technology areasH10W H10P H10N G11C H10K

Files withTAIWAN SEMICONDUCTOR MFG CO LTD39

Top patents by PatentIndex Score

39 records

0198US11855130B2Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·9 cites·17 claims
0296US11721794B2Method for manufacturing reflective structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·2 cites·20 claims
0396US10748798B1Wireless camera wafer for vacuum chamber diagnosticsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·15 cites·20 claims
0494US11881421B2Semiconductor die carrier structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 23, 2024·3 cites·20 claims
0591US11527713B2Top electrode via with low contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·3 cites·20 claims
0687US11257997B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 22, 2022·2 cites·20 claims
0786US11527717B2Resistive memory cell having a low forming voltageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·2 cites·20 claims
0886US2025316646A1Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0985US11024774B2Display device reflector having improved reflectivityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·2 cites·20 claims
1084US12338943B2Apparatus for storing and transporting semiconductor elements, and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 24, 2025·0 cites·20 claims
1184US12102019B2Data storage structure for improving memory cell reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·20 claims
1283US12272724B2Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
1383US2024395773A1Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1483US2024387618A1Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1583US2025285897A1Semiconductor die carrier structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1682US12322623B2Semiconductor die carrier structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
1781US12381181B2Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
1880US12094925B1Three-dimensional device structure including embedded integrated passive device and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
1980US2025203893A1Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2079US12278167B2Semiconductor die including through substrate via barrier structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
2179US12239035B2Resistive memory cell having a low forming voltageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
2279US11716913B2Data storage structure for improving memory cell reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 1, 2023·0 cites·20 claims
2379US2024387424A1Film structure for bond padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2479US2024363682A1Three-dimensional device structure including embedded integrated passive device and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2577US2025210468A1Semiconductor die including through substrate via barrier structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2676US12218180B2Multi-layered resistor with a tight temperature coefficient of resistance toleranceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
2776US2024393531A1Photonic Device on a Semiconductor-on-Insulator Substrate and Method of Manufacturing ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2875US2024379732A1Multi-layered resistor with a tight temperature coefficient of resistance toleranceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2974US12249586B2Film structure for bond padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 11, 2025·0 cites·20 claims
3074US11742325B2Semiconductor device including a plurality of dielectric materials between semiconductor dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
3173US2025176447A1Resistive memory cell having a low forming voltageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3272US11908838B2Three-dimensional device structure including embedded integrated passive device and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
3371US12322679B2Semiconductor die including through substrate via barrier structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
3469US12222542B2Photonic device on a semiconductor-on-insulator substrate and method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·20 claims
3569US11923403B2Multi-layered resistor with a tight temperature coefficient of resistance toleranceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
3666US11131025B2Wireless camera wafer for vacuum chamber diagnosticsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
3765US11309491B2Data storage structure for improving memory cell reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
3862US11322464B2Film structure for bond padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 3, 2022·0 cites·20 claims
3947US10720581B2Barrier layer for resistive random access memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →