Inventor · disambiguated record
Tzu-Sheng Tseng
Also filed as: TSENG TZU-SHENG
1 granted patent·2 pending applications·18 citations·filing 2006–2023
38Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0183US7399399B2Method for manufacturing semiconductor package substratePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Jul 15, 2008·18 cites·6 claims
- 0247US2025183140A1Integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0336US2007087587A1Method for manufacturing circuit board for semiconductor packageCHANG MING Y·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tzu-Sheng Tseng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →