Inventor · disambiguated record
Tzu-Chien Wei
Also filed as: WEI TZU-CHIEN
13 granted patents·6 pending applications·30 citations·filing 2007–2024
87Inventor score
Files withUNIV NAT TSING HUA10TRIPOD TECHNOLOGY CORP4NAT UNIV TSING HUA3CHENG HAI-PENG1WEI TZU-CHIEN1
Top patents by PatentIndex Score
19 records- 0186US8241372B2Electrochemical device and method of fabricating the sameCHENG HAI-PENG·Filed 2009·Granted Aug 14, 2012·18 cites·8 claims
- 0277US11331883B2Diffusion barrier structure, and conductive laminate and manufacturing method thereofUNIV NAT TSING HUA·Filed 2019·Granted May 17, 2022·2 cites·18 claims
- 0372US10883193B2Method for preparing perovskite crystalUNIV NAT TSING HUA·Filed 2018·Granted Jan 5, 2021·2 cites·18 claims
- 0469US11745469B2Conductive laminate and method for manufacturing the sameUNIV NAT TSING HUA·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 0568US11865518B2Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrateUNIV NAT TSING HUA·Filed 2020·Granted Jan 9, 2024·0 cites·20 claims
- 0666US7838065B2Method for preparing an electrode comprising an electrochemical catalyst layer thereonNAT UNIV TSING HUA·Filed 2007·Granted Nov 23, 2010·3 cites·23 claims
- 0765US10828624B2Self-adsorbed catalyst composition, method for preparing the same and method for manufacturing electroless plating substrateUNIV NAT TSING HUA·Filed 2018·Granted Nov 10, 2020·0 cites·5 claims
- 0862US9875984B2Substrate surface metallization method and substrate having metallized surface manufactured by the sameUNIV NAT TSING HUA·Filed 2016·Granted Jan 23, 2018·1 cites·20 claims
- 0962US8298434B2Method of forming an electrode including an electrochemical catalyst layerWEI TZU-CHIEN·Filed 2009·Granted Oct 30, 2012·2 cites·14 claims
- 1061US9514965B2Substrate surface metallization method and substrate having metallized surface manufactured by the sameNAT UNIV TSING HUA·Filed 2015·Granted Dec 6, 2016·1 cites·9 claims
- 1161US8349394B2Method of forming an electrode including an electrochemical catalyst layerTRIPOD TECHNOLOGY CORP·Filed 2008·Granted Jan 8, 2013·1 cites·6 claims
- 1259US2025287508A1Carrier-attached ultra-thin copper foil and manufacturing method thereofUNIV NAT TSING HUA·Filed 2024·Application pending·0 cites
- 1357US11098407B2Method for no-silane electroless metal deposition using high adhesive catalyst and product therefromUNIV NAT TSING HUA·Filed 2019·Granted Aug 24, 2021·0 cites·19 claims
- 1452US2024155854A1Composite electrode structure and method for manufacturing the sameUNIV NAT TSING HUA·Filed 2023·Application pending·0 cites
- 1552US2010071759A1Electrochemical Device and Method of Fabricating the SameTRIPOD TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 1642US2010101623A1Packaging structureTRIPOD TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 1741US2010101644A1Electrolyte composition and dye-sensitized solar cell (dssc) comprising the sameTRIPOD TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 1838US2017081766A1Method for no-silane electroless metal deposition using high adhesive catalyst and product therefromNAT UNIV TSING HUA·Filed 2016·Application pending·0 cites
- 1932US11313670B2Inspection method for multilayer semiconductor deviceUNIV NAT TSING HUA·Filed 2020·Granted Apr 26, 2022·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →