Inventor · disambiguated record

Tzu-Hsuan Yeh

Also filed as: YEH TZU-HSUAN

5 granted patents·2 pending applications·2 citations·filing 2020–2024

68Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD7

Top patents by PatentIndex Score

7 records

0193US12218005B2Integrated circuit deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 4, 2025·1 cites·20 claims
0280US12165996B2Bond pad with enhanced reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
0380US11244914B2Bond pad with enhanced reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·1 cites·20 claims
0480US2025140608A1Integrated circuit structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0580US2024379594A1Bond pad with enhanced reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0674US11824022B2Bond pad with enhanced reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
0767US11894267B2Method for fabricating integrated circuit deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →