Inventor · disambiguated record
Ulrich Tschinderle
Also filed as: TSCHINDERLE ULRICH
8 granted patents·5 pending applications·10 citations·filing 2011–2023
77Inventor score
Top patents by PatentIndex Score
13 records- 0186US10658204B2Spin chuck with concentrated center and radial heatingLAM RES AG·Filed 2017·Granted May 19, 2020·7 cites·18 claims
- 0284US11942356B2Clipping mechanism for fastening a substrate for a surface treatment of the substrateSEMSYSCO GMBH·Filed 2021·Granted Mar 26, 2024·1 cites·6 claims
- 0361US10269615B2Apparatus for treating surfaces of wafer-shaped articlesTSCHINDERLE ULRICH·Filed 2011·Granted Apr 23, 2019·1 cites·20 claims
- 0458US9633890B2Device for treating surfaces of wafer-shaped articles and gripping pin for use in the deviceTSCHINDERLE ULRICH·Filed 2011·Granted Apr 25, 2017·1 cites·18 claims
- 0555US2024141535A1System for a chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2021·Application pending·0 cites
- 0654US2025333874A1Module kit for a chemical and/or electrolytic surface treatment of a substrateSEMSYSCO GMBH·Filed 2023·Application pending·0 cites
- 0749US10056287B2Apparatus for treating surfaces of wafer-shaped articlesLAM RES AG·Filed 2015·Granted Aug 21, 2018·0 cites·19 claims
- 0845US2024213066A1Frame system for holding a substrateSEMSYSCO GMBH·Filed 2022·Application pending·0 cites
- 0942US10134611B2Collector for use with an apparatus for treating wafer-shaped articlesLAM RES AG·Filed 2013·Granted Nov 20, 2018·0 cites·17 claims
- 1040US8974632B2Device and method for treating wafer-shaped articlesTSCHINDERLE ULRICH·Filed 2011·Granted Mar 10, 2015·0 cites·8 claims
- 1139US11810796B2Wafer cleaning method and apparatus thereforeLAM RES AG·Filed 2019·Granted Nov 7, 2023·0 cites·13 claims
- 1235US2013101372A1Method and apparatus for processing wafer-shaped articlesTSCHINDERLE ULRICH·Filed 2011·Application pending·0 cites
- 1324US2012305036A1Device for treating surfaces of wafer-shaped articlesLACH OTTO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →