Inventor · disambiguated record
Ulrich Wachter
Also filed as: WACHTER ULRICH · WAECHTER ULRICH · WÄCHTER ULRICH
15 granted patents·3 pending applications·105 citations·filing 2009–2024
91Inventor score
Files withINFINEON TECHNOLOGIES AG12EGO ELEKTRO GERAETEBAU GMBH2BAUER MICHAEL1GEITNER OTTMAR1HIRTREITER JOSEF1
Top patents by PatentIndex Score
18 records- 0194US8890284B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Nov 18, 2014·17 cites·20 claims
- 0294US7943423B2Reconfigured wafer alignmentINFINEON TECHNOLOGIES AG·Filed 2009·Granted May 17, 2011·28 cites·24 claims
- 0391US8828807B1Method of packaging integrated circuits and a molded substrate with non-functional placeholders embedded in a molding compoundINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 9, 2014·11 cites·22 claims
- 0490US8669655B2Chip package and a method for manufacturing a chip packageGEITNER OTTMAR·Filed 2012·Granted Mar 11, 2014·26 cites·24 claims
- 0585US9099454B2Molded semiconductor package with backside die metallizationINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 4, 2015·8 cites·22 claims
- 0678US8912087B2Method of fabricating a chip packageHIRTREITER JOSEF·Filed 2012·Granted Dec 16, 2014·7 cites·25 claims
- 0773US9147585B2Method for fabricating a plurality of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 29, 2015·2 cites·9 claims
- 0870US9275878B2Metal redistribution layer for molded substratesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·2 cites·10 claims
- 0968US9718678B2Package arrangement, a package, and a method of manufacturing a package arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 1, 2017·2 cites·17 claims
- 1067US8906749B2Method for fabricating a semiconductor deviceBAUER MICHAEL·Filed 2012·Granted Dec 9, 2014·2 cites·18 claims
- 1158US12374923B2Method of operating an apparatus for wirelessly transmitting electrical power in the direction of an electrical consumer and systemEGO ELEKTRO GERAETEBAU GMBH·Filed 2024·Granted Jul 29, 2025·0 cites·12 claims
- 1256US9487392B2Method of packaging integrated circuits and a molded packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 8, 2016·0 cites·18 claims
- 1354US2025079909A1System for wirelessly transferring energyEGO ELEKTRO GERAETEBAU GMBH·Filed 2023·Application pending·0 cites
- 1448US9806056B2Method of packaging integrated circuitsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 31, 2017·0 cites·17 claims
- 1545US9711462B2Package arrangement including external block comprising semiconductor material and electrically conductive plastic materialINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 18, 2017·0 cites·25 claims
- 1645US9620457B2Semiconductor device packagingINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 11, 2017·0 cites·14 claims
- 1744US2016035677A1Method for forming a package arrangement and package arrangementINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 1842US2013139704A1Cooking Vessel, Heating Device and Cooking SystemSCHILLING WILFRIED·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →