Inventor · disambiguated record
Umang Desai
Also filed as: DESAI UMANG
0 granted patents·14 pending applications·0 citations·filing 2020–2025
Files withINTEL CORP14
Top patents by PatentIndex Score
14 records- 0165US2025221041A1Integrated circuit structure with front-side-guided backside source or drain contactINTEL CORP·Filed 2023·Application pending·0 cites
- 0263US2025228008A1Integrated circuit structure with front-side-guided backside source or drain contactINTEL CORP·Filed 2025·Application pending·0 cites
- 0359US2025393283A1Thin film transistors having self-aligned contact metallizationINTEL CORP·Filed 2024·Application pending·0 cites
- 0455US2025393245A1Integrated circuit structure with spacer-guided backside conductive contactINTEL CORP·Filed 2024·Application pending·0 cites
- 0555US2025210522A1Air-gapped isolation wallsINTEL CORP·Filed 2023·Application pending·0 cites
- 0655US2025218937A1Directed self assembly-enabled back-side contact arrays aligned to gate electrodesINTEL CORP·Filed 2023·Application pending·0 cites
- 0754US2025210412A1Recessed oxide and seam-first etch for air-gapped isolation wallsINTEL CORP·Filed 2023·Application pending·0 cites
- 0854US2025221040A1Integrated circuit structure with front-side-cut backside source or drain contactINTEL CORP·Filed 2023·Application pending·0 cites
- 0953US2025220991A1Integrated circuit structure with direct backside source or drain contactINTEL CORP·Filed 2023·Application pending·0 cites
- 1053US2025220994A1Backside epitaxial growth for improved contact areaINTEL CORP·Filed 2023·Application pending·0 cites
- 1153US2025393251A1Integrated circuit structure with backside conductive feed-throughINTEL CORP·Filed 2024·Application pending·0 cites
- 1251US2025220959A1Front side and backside source or drain contactsINTEL CORP·Filed 2023·Application pending·0 cites
- 1348US2024355915A1Backside conductive structures extending through integrated circuit to meet frontside contactsINTEL CORP·Filed 2023·Application pending·0 cites
- 1442US2022068802A1Metal line and via barrier layers, and via profiles, for advanced integrated circuit structure fabricationINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →