Inventor · disambiguated record
Ung-Kwang Kim
Also filed as: KIM UNG-KWANG
2 granted patents·1 pending application·360 citations·filing 2005–2006
67Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0197US7151009B2Method for manufacturing wafer level chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 19, 2006·356 cites·20 claims
- 0267US7524763B2Fabrication method of wafer level chip scale packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 28, 2009·4 cites·12 claims
- 0347US2007200216A1Chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →