Inventor · disambiguated record
Ungcheon Kim
Also filed as: KIM UNGCHEON
7 granted patents·2 pending applications·3 citations·filing 2020–2025
73Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0189US11848307B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 19, 2023·2 cites·20 claims
- 0283US11984415B2Interposer, method for fabricating the same, and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 14, 2024·1 cites·20 claims
- 0378US2025132238A1Interposer, semiconductor package including the same, and method of fabricating the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0475US12272630B2Interposer and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·16 claims
- 0574US12417988B2Interposer, method for fabricating the same, and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Sep 16, 2025·0 cites·13 claims
- 0672US12218043B2Interposer, semiconductor package including the same, and method of fabricating the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 0772US2025192015A1Interposer and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0867US11482483B2Interposer, semiconductor package including the same, and method of fabricating the interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 0966US11728255B2Interposer and semiconductor package including sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →