Inventor · disambiguated record
Urusa Alaan
Also filed as: ALAAN URUSA · ALAAN URUSA SHAHRIAR
23 granted patents·9 pending applications·14 citations·filing 2018–2024
91Inventor score
Top patents by PatentIndex Score
32 records- 0196US11996411B2Stacked forksheet transistorsINTEL CORP·Filed 2020·Granted May 28, 2024·4 cites·21 claims
- 0293US11830788B2Integrated circuits and methods for forming integrated circuitsINTEL CORP·Filed 2021·Granted Nov 28, 2023·2 cites·6 claims
- 0381US11569231B2Non-planar transistors with channel regions having varying widthsINTEL CORP·Filed 2019·Granted Jan 31, 2023·3 cites·21 claims
- 0481US11171239B2Transistor channel passivation with 2D crystalline materialINTEL CORP·Filed 2019·Granted Nov 9, 2021·2 cites·17 claims
- 0574US11276644B2Integrated circuits and methods for forming thin film crystal layersINTEL CORP·Filed 2018·Granted Mar 15, 2022·1 cites·9 claims
- 0673US11672133B2Vertically stacked memory elements with air gapINTEL CORP·Filed 2019·Granted Jun 6, 2023·1 cites·19 claims
- 0773US2024234422A1Stacked forksheet transistorsINTEL CORP·Filed 2024·Application pending·0 cites
- 0872US12211794B2Integrated circuits and methods for forming thin film crystal layersINTEL CORP·Filed 2022·Granted Jan 28, 2025·0 cites·9 claims
- 0971US11888034B2Transistors with metal chalcogenide channel materialsINTEL CORP·Filed 2019·Granted Jan 30, 2024·1 cites·19 claims
- 1068US12107170B2Transistor channel passivation with 2D crystalline materialINTEL CORP·Filed 2021·Granted Oct 1, 2024·0 cites·17 claims
- 1167US2023163215A1Gate-all-around integrated circuit structures having fin stack isolationINTEL CORP·Filed 2023·Application pending·0 cites
- 1264US12400913B2Contact over active gate structures with conductive trench contact taps for advanced integrated circuit structure fabricationINTEL CORP·Filed 2021·Granted Aug 26, 2025·0 cites·20 claims
- 1363US11594637B2Gate-all-around integrated circuit structures having fin stack isolationINTEL CORP·Filed 2020·Granted Feb 28, 2023·0 cites·13 claims
- 1459US11164809B2Integrated circuits and methods for forming integrated circuitsINTEL CORP·Filed 2018·Granted Nov 2, 2021·0 cites·14 claims
- 1558US12058847B2Monolithic memory stackINTEL CORP·Filed 2020·Granted Aug 6, 2024·0 cites·20 claims
- 1657US12324204B2Transistors including two-dimensional materialsINTEL CORP·Filed 2020·Granted Jun 3, 2025·0 cites·20 claims
- 1756US12349442B2Thin film transistors having semiconductor structures integrated with 2D channel materialsINTEL CORP·Filed 2021·Granted Jul 1, 2025·0 cites·20 claims
- 1856US12328946B2ESD protection decoupled from diffusionINTEL CORP·Filed 2020·Granted Jun 10, 2025·0 cites·17 claims
- 1955US12369399B2Gate-to-gate isolation for stacked transistor architecture via selective dielectric deposition structureINTEL CORP·Filed 2021·Granted Jul 22, 2025·0 cites·20 claims
- 2052US12057388B2Integrated circuit structures having linerless self-forming barriersINTEL CORP·Filed 2019·Granted Aug 6, 2024·0 cites·23 claims
- 2151US12432948B2Compositional engineering of Schottky diodeINTEL CORP·Filed 2020·Granted Sep 30, 2025·0 cites·8 claims
- 2251US2023187509A1Stacked transistors with removed epi barrierINTEL CORP·Filed 2021·Application pending·0 cites
- 2350US11482622B2Adhesion structure for thin film transistorINTEL CORP·Filed 2018·Granted Oct 25, 2022·0 cites·22 claims
- 2449US11594485B2Local interconnect with air gapINTEL CORP·Filed 2019·Granted Feb 28, 2023·0 cites·20 claims
- 2549US2023081882A1Stacked memory structure with dual-channel transistorINTEL CORP·Filed 2021·Application pending·0 cites
- 2648US2022199801A1Novel method to form single crystal mosfet and fefetINTEL CORP·Filed 2020·Application pending·0 cites
- 2748US2023113614A1Thin film transistors having cmos functionality integrated with 2d channel materialsINTEL CORP·Filed 2021·Application pending·0 cites
- 2847US11574910B2Device with air-gaps to reduce coupling capacitance and process for forming suchINTEL CORP·Filed 2019·Granted Feb 7, 2023·0 cites·14 claims
- 2947US2022102268A1Damascene interconnect structures with low resistance vias for integrated circuitsINTEL CORP·Filed 2020·Application pending·0 cites
- 3047US2023134379A1Lattice stack for internal spacer fabricationINTEL CORP·Filed 2021·Application pending·0 cites
- 3143US11670588B2Selectable vias for back end of line interconnectsINTEL CORP·Filed 2019·Granted Jun 6, 2023·0 cites·13 claims
- 3242US2020098824A1Diode based resistive random access memorySHARMA ABHISHEK·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →