Inventor · disambiguated record
Ute Steinhaeusser
Also filed as: STEINHAEUSSER UTE
3 granted patents·4 citations·filing 2020–2021
53Inventor score
Files withRF360 SINGAPORE PTE LTD3
Top patents by PatentIndex Score
3 records- 0182US11894829B2Variation of metal layer stack under under bump metallization (UBM)RF360 SINGAPORE PTE LTD·Filed 2020·Granted Feb 6, 2024·4 cites·30 claims
- 0246US12074120B2Electric component with pad for a bump and manufacturing method thereofRF360 SINGAPORE PTE LTD·Filed 2020·Granted Aug 27, 2024·0 cites·17 claims
- 0346US11967938B2Corrosion resistant pad for enhanced thin film acoustic packaging (TFAP)RF360 SINGAPORE PTE LTD·Filed 2021·Granted Apr 23, 2024·0 cites·56 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →