Inventor · disambiguated record
Vaidyanathan Kripesh
Also filed as: KRIPESH VAIDYANATHAN
11 granted patents·9 pending applications·501 citations·filing 2002–2011
92Inventor score
Files withAGENCY SCIENCE TECH & RES7INFINEON TECHNOLOGIES AG2INST OF MICROELECTRONICS2KOTLANKA RAMA KRISHNA2KRIPESH VAIDYANATHAN2
Top patents by PatentIndex Score
20 records- 0196US6846725B2Wafer-level package for micro-electro-mechanical systemsINST OF MICROELECTRONICS·Filed 2003·Granted Jan 25, 2005·238 cites·18 claims
- 0291US6717812B1Apparatus and method for fluid-based cooling of heat-generating devicesINST OF MICROELECTRONICS·Filed 2003·Granted Apr 6, 2004·113 cites·19 claims
- 0387US7230318B2RF and MMIC stackable micro-modulesAGENCY SCIENCE TECH & RES·Filed 2003·Granted Jun 12, 2007·48 cites·13 claims
- 0483US6872464B2Soldering agent for use in diffusion soldering processes, and method for producing soldered joints using the soldering agentINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 29, 2005·32 cites·20 claims
- 0574US7141487B2Method for ultra thinning bumped wafers for flip chipAGENCY SCIENCE TECH & RES·Filed 2004·Granted Nov 28, 2006·22 cites·55 claims
- 0673US6787456B1Wafer-level inter-connector formation methodAGENCY SCIENCE TECH & RES·Filed 2003·Granted Sep 7, 2004·21 cites·29 claims
- 0766US7160756B2Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devicesAGENCY FOR SCIENCE TECHOLOGY A·Filed 2004·Granted Jan 9, 2007·18 cites·26 claims
- 0863US7592703B2RF and MMIC stackable micro-modulesAGENCY SCIENCE TECH & RES·Filed 2007·Granted Sep 22, 2009·2 cites·19 claims
- 0952US2011316117A1Die package and a method for manufacturing the die packageKRIPESH VAIDYANATHAN·Filed 2008·Application pending·0 cites
- 1050US7189594B2Wafer level packages and methods of fabricationAGENCY SCIENCE TECH & RES·Filed 2004·Granted Mar 13, 2007·5 cites·25 claims
- 1145US6773956B2Method for contact-connecting a semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 10, 2004·2 cites·16 claims
- 1242US8466550B2Semiconductor structure and a method of manufacturing a semiconductor structureKALANDAR NAVAS KHAN ORATTI·Filed 2008·Granted Jun 18, 2013·0 cites·13 claims
- 1341US2006223313A1Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the sameAGENCY SCIENCE TECH & RES·Filed 2006·Application pending·0 cites
- 1440US2012126419A1Substrate Arrangement and a Method of Manufacturing a Substrate ArrangementKRIPESH VAIDYANATHAN·Filed 2008·Application pending·0 cites
- 1540US2010187682A1Electronic package and method of assembling the samePINJALA DAMARUGANATH·Filed 2007·Application pending·0 cites
- 1637US2010170086A1Device, unit, system and method for the magnetically-assisted assembling of chip-scale, and nano and micro-scale components onto a substrateAGENCY SCIENCE TECH & RES·Filed 2006·Application pending·0 cites
- 1737US2013324863A1Guide wire arrangement, strip arrangement and methods of forming the sameYU DAQUAN·Filed 2011·Application pending·0 cites
- 1834US2013053730A1Miniature Sensor Tip for Medical Devices and Method of Forming the SameKOTLANKA RAMA KRISHNA·Filed 2010·Application pending·0 cites
- 1934US2002175424A1Process of forming metal surfaces compatible with a wire bonding and semiconductor integrated circuits manufactured by the processFiled 2002·Application pending·0 cites
- 2034US2013053711A1Implantable Device for Detecting Variation in Fluid Flow RateKOTLANKA RAMA KRISHNA·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →