Inventor · disambiguated record
Vadali Mahadev
Also filed as: MAHADEV VADALI
6 granted patents·80 citations·filing 2003–2021
83Inventor score
Top patents by PatentIndex Score
6 records- 0194US7585702B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateALTERA CORP·Filed 2005·Granted Sep 8, 2009·38 cites·12 claims
- 0288US10048306B1Methods and apparatus for automated integrated circuit package testingALTERA CORP·Filed 2015·Granted Aug 14, 2018·12 cites·9 claims
- 0382US8212353B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateWANG WEN-CHOU VINCENT·Filed 2010·Granted Jul 3, 2012·8 cites·14 claims
- 0482US7741160B1Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrateALTERA CORP·Filed 2009·Granted Jun 22, 2010·9 cites·6 claims
- 0563US7210081B1Apparatus and methods for assessing reliability of assemblies using programmable logic devicesALTERA CORP·Filed 2003·Granted Apr 24, 2007·13 cites·55 claims
- 0655US12417331B2Systems and methods for circuit design dependent programmable maximum junction temperaturesINTEL CORP·Filed 2021·Granted Sep 16, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →