Inventor · disambiguated record
Vadim Sherman
Also filed as: SHERMAN VADIM
4 granted patents·1 pending application·8 citations·filing 2005–2013
66Inventor score
Top patents by PatentIndex Score
5 records- 0174US8143721B2Package substrate dynamic pressure structureONGCHIN STEWART M·Filed 2007·Granted Mar 27, 2012·7 cites·21 claims
- 0258US8617921B2Package substrate dynamic pressure structureONGCHIN STEWART M·Filed 2012·Granted Dec 31, 2013·1 cites·10 claims
- 0350US9111929B2Package substrate dynamic pressure structureONGCHIN STEWART M·Filed 2013·Granted Aug 18, 2015·0 cites·20 claims
- 0435US7518222B2Apparatus and system for an IC substrate, socket, and assemblyINTEL CORP·Filed 2006·Granted Apr 14, 2009·0 cites·17 claims
- 0532US2006289986A1In-package connection between integrated circuit dies via flex tapeSHERMAN VADIM·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →