Inventor · disambiguated record
Vani Verma
Also filed as: VERMA VANI
13 granted patents·1 pending application·219 citations·filing 1999–2013
92Inventor score
Files withCYPRESS SEMICONDUCTOR CORP7MATRIX SEMICONDUCTOR INC2SANDISK TECHNOLOGIES INC2YU CHEEMEN2SANDISK 3D LLC1
Top patents by PatentIndex Score
14 records- 0191US6731011B2Memory module having interconnected and stacked integrated circuitsMATRIX SEMICONDUCTOR INC·Filed 2002·Granted May 4, 2004·56 cites·20 claims
- 0288US7432599B2Memory module having interconnected and stacked integrated circuitsSANDISK 3D LLC·Filed 2006·Granted Oct 7, 2008·14 cites·11 claims
- 0388US7005730B2Memory module having interconnected and stacked integrated circuitsMATRIX SEMICONDUCTOR INC·Filed 2004·Granted Feb 28, 2006·42 cites·6 claims
- 0482US6562272B1Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packagesCYPRESS SEMICONDUCTOR CORP·Filed 2000·Granted May 13, 2003·24 cites·20 claims
- 0578US7105377B1Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing processCYPRESS SEMICONDUCTOR CORP·Filed 2004·Granted Sep 12, 2006·21 cites·13 claims
- 0677US8395246B2Two-sided die in a four-sided leadframe based packageYU CHEEMEN·Filed 2007·Granted Mar 12, 2013·8 cites·19 claims
- 0777US7391104B1Non-stick detection method and mechanism for array molded laminate packagesCYPRESS SEMICONDUCTOR CORP·Filed 2005·Granted Jun 24, 2008·9 cites·29 claims
- 0864US6853202B1Non-stick detection method and mechanism for array molded laminate packagesCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted Feb 8, 2005·13 cites·11 claims
- 0958US6331728B1High reliability lead frame and packaging technology containing the sameCYPRESS SEMICONDUCTOR CORP·Filed 1999·Granted Dec 18, 2001·22 cites·13 claims
- 1056US6730532B1Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing processCYPRESS SEMICONDUCTOR CORP·Filed 2002·Granted May 4, 2004·5 cites·16 claims
- 1152US6576491B1Methods for producing high reliability lead frame and packaging semiconductor die using such lead frameCYPRESS SEMICONDUCTOR CORP·Filed 2001·Granted Jun 10, 2003·5 cites·30 claims
- 1250US2013200507A1Two-sided die in a four-sided leadframe based packageSANDISK TECHNOLOGIES INC·Filed 2013·Application pending·0 cites
- 1347US8058099B2Method of fabricating a two-sided die in a four-sided leadframe based packageYU CHEEMEN·Filed 2007·Granted Nov 15, 2011·0 cites·17 claims
- 1446US8349655B2Method of fabricating a two-sided die in a four-sided leadframe based packageSANDISK TECHNOLOGIES INC·Filed 2010·Granted Jan 8, 2013·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when Vani Verma files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →