Inventor · disambiguated record
Valerie Vivares
Also filed as: VIVARES VALERIE
8 granted patents·2 pending applications·84 citations·filing 2000–2019
86Inventor score
Top patents by PatentIndex Score
10 records- 0169US6348142B1Electroplating multi-trace circuit board substrates using single tie barADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 19, 2002·19 cites·17 claims
- 0268US6426290B1Electroplating both sides of a workpieceADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 30, 2002·17 cites·20 claims
- 0366US6432291B1Simultaneous electroplating of both sides of a dual-sided substrateADVANCED MICRO DEVICES INC·Filed 2000·Granted Aug 13, 2002·15 cites·17 claims
- 0458US6319752B1Single-layer autorouterADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 20, 2001·12 cites·8 claims
- 0556US6983438B1Design tool for integrated circuit designADVANCED MICRO DEVICES INC·Filed 2000·Granted Jan 3, 2006·9 cites·18 claims
- 0654US6569694B1Method of checking BGA substrate designADVANCED MICRO DEVICES INC·Filed 2001·Granted May 27, 2003·8 cites·9 claims
- 0744US6515354B1Micro-BGA beam lead connection with cantilevered beam leadsADVANCED MICRO DEVICES INC·Filed 2000·Granted Feb 4, 2003·2 cites·7 claims
- 0842US6621043B1Laser trim process controlADVANCED MICRO DEVICES INC·Filed 2001·Granted Sep 16, 2003·2 cites·5 claims
- 0938US2018218992A1Semiconductor Device, Method for Fabricating a Semiconductor Device and Method for Reinforcing a Die in a Semiconductor DeviceINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 1037US2020294877A1Molded Semiconductor Package with Mold Surface ModificationINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →