Inventor · disambiguated record
Vernon Williams
Also filed as: WILLIAMS VERNON M
28 granted patents·11 pending applications·572 citations·filing 2000–2007
97Inventor score
Top patents by PatentIndex Score
39 records- 0197US7323767B2Standoffs for centralizing internals in packaging processMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 29, 2008·121 cites·86 claims
- 0297US6558600B1Method for packaging microelectronic substratesMICRON TECHNOLOGY INC·Filed 2000·Granted May 6, 2003·75 cites·14 claims
- 0397US6468891B2Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 22, 2002·76 cites·14 claims
- 0495US6632732B2Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 14, 2003·38 cites·20 claims
- 0589US7557452B1Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 7, 2009·43 cites·129 claims
- 0686US6764935B2Stereolithographic methods for fabricating conductive elementsMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 20, 2004·17 cites·21 claims
- 0782US6730998B1Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including sameMICRON TECHNOLOGY INC·Filed 2000·Granted May 4, 2004·24 cites·39 claims
- 0882US6500746B2Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 31, 2002·42 cites·20 claims
- 0975US6815253B2Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 9, 2004·8 cites·38 claims
- 1074US6764933B2Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 20, 2004·25 cites·24 claims
- 1172US6602430B1Methods for finishing microelectronic device packagesMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 5, 2003·20 cites·41 claims
- 1269US6780744B2Stereolithographic methods for securing conductive elements to contacts of semiconductor device componentsMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 24, 2004·18 cites·16 claims
- 1367US7459797B2Standoffs for centralizing internals in packaging processMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 2, 2008·9 cites·30 claims
- 1467US6767815B2Stereolithographically fabricated conductive elements, semiconductor device components and assemblies including such conductive elements, and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 27, 2004·18 cites·21 claims
- 1566US6863516B2Transfer molding and underfilling apparatusMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 8, 2005·10 cites·11 claims
- 1665US7137193B2Programmed material consolidation methods for fabricating printed circuit boardMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 21, 2006·4 cites·6 claims
- 1762US7501309B2Standoffs for centralizing internals in packaging processMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 10, 2009·1 cites·32 claims
- 1862US7205654B2Programmed material consolidation methods for fabricating heat sinksMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 17, 2007·1 cites·22 claims
- 1960US6838319B1Transfer molding and underfilling method and apparatus including orienting the active surface of a semiconductor substrate substantially verticallyMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 4, 2005·7 cites·41 claims
- 2056US6830954B2Transfer molding and underfilling method and apparatusMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 14, 2004·5 cites·28 claims
- 2154US7462510B2Standoffs for centralizing internals in packaging processMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 9, 2008·3 cites·70 claims
- 2254US2007062033A1Selective consolidation methods for fabricating semiconductor device components and conductive features thereofWILLIAMS VERNON M·Filed 2006·Application pending·0 cites
- 2352US6977211B2Selective consolidation processes for electrically connecting contacts of semiconductor device componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 20, 2005·1 cites·22 claims
- 2452US2003209831A1Method and apparatus for packaging microelectronic substratesFiled 2003·Application pending·0 cites
- 2551US2005230806A1Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elementsWILLIAMS VERNON M·Filed 2005·Application pending·0 cites
- 2651US2005221531A1Carrier substrates and conductive elements thereofWILLIAMS VERNON M·Filed 2005·Application pending·0 cites
- 2751US2006237832A1Standoffs for centralizing internals in packaging processMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
- 2851US2005230843A1Flip-chip type semiconductor devices and conductive elements thereofWILLIAMS VERNON M·Filed 2005·Application pending·0 cites
- 2950US2007148818A1Electrical connection methods employing corresponding, insulator-coated members of interconnection elementsWILLIAMS VERNON M·Filed 2007·Application pending·0 cites
- 3050US2007148817A1Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device componentsWILLIAMS VERNON M·Filed 2007·Application pending·0 cites
- 3149US6666997B2Method for removing cleaning compound flash from mold ventsMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 23, 2003·3 cites·31 claims
- 3249US2003235663A1Method and apparatus for packaging microelectronic substratesFiled 2003·Application pending·0 cites
- 3346US7273802B2Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact padsMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 25, 2007·0 cites·38 claims
- 3446US7264456B2Leadframe and method for reducing mold compound adhesion problemsMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 4, 2007·2 cites·23 claims
- 3546US7239015B2Heat sinks including nonlinear passagewaysMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 3, 2007·1 cites·18 claims
- 3645US2006082021A1Leadframe and method for reducing mold compound adhesion problemsWILLIAMS VERNON M·Filed 2005·Application pending·0 cites
- 3741US7026191B2Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including sameMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 11, 2006·0 cites·25 claims
- 3839US7029256B2Leadframe and method for removing cleaning compound flash from mold ventsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 18, 2006·0 cites·16 claims
- 3935US2004104200A1Methods for finishing microelectronic device packagesFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →