Inventor · disambiguated record
Vinay Badhwar
Also filed as: BADHWAR VINAY
10 granted patents·11 citations·filing 2011–2021
81Inventor score
Top patents by PatentIndex Score
10 records- 0170US12508126B2Double component mandrel for electrospun stentless, multi-leaflet valve fabricationUNIV OF PITTSBURGH—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION·Filed 2021·Granted Dec 30, 2025·0 cites·14 claims
- 0270US8663249B2Automatic suturing apparatus and methods of useBADHWAR VINAY·Filed 2011·Granted Mar 4, 2014·8 cites·21 claims
- 0369US11337799B2Stentless biopolymer heart valve replacement capable of living tissue regenerationUNIV OF PITTSBURGH—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION·Filed 2018·Granted May 24, 2022·2 cites·14 claims
- 0462US11129711B2Double component mandrel for electrospun stentless, multi-leaflet valve fabricationUNIV OF PITTSBURGH—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION·Filed 2016·Granted Sep 28, 2021·1 cites·12 claims
- 0560US11771555B2Retrievable self-expanding non-thrombogenic low-profile percutaneous atrioventricular valve prosthesisUNIV OF PITTSBURGH—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION·Filed 2020·Granted Oct 3, 2023·0 cites·19 claims
- 0649US10583004B2Retrievable self-expanding non-thrombogenic low-profile percutaneous atrioventricular valve prosthesisUNIV OF PITTSBURGH—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION·Filed 2016·Granted Mar 10, 2020·0 cites·19 claims
- 0747US9357999B2Automatic suturing apparatus and methods of useBADHWAR VINAY·Filed 2014·Granted Jun 7, 2016·0 cites·15 claims
- 0842US12280195B2Expandable percutaneous cannulaUNIV OF PITTSBURGH—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION·Filed 2018·Granted Apr 22, 2025·0 cites·18 claims
- 0942US11045218B2Transatrial access for intracardiac therapyUNIV OF PITTSBURGH—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION·Filed 2017·Granted Jun 29, 2021·0 cites·23 claims
- 1039US9358109B2Transcorporeal delivery system and methodBADHWAR VINAY·Filed 2011·Granted Jun 7, 2016·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →