Inventor · disambiguated record
Viorel Balan
Also filed as: BALAN VIOREL
3 granted patents·7 citations·filing 2015–2020
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0180US9620385B2Method of planarizing recesses filled with copperST MICROELECTRONICS CROLLES 2 SAS·Filed 2015·Granted Apr 11, 2017·4 cites·6 claims
- 0277US9865545B2Plurality of substrates bonded by direct bonding of copper recessesST MICROELECTRONICS CROLLES 2 SAS·Filed 2017·Granted Jan 9, 2018·3 cites·12 claims
- 0342US12322717B2Semiconductor device and method for manufacturing a semiconductor deviceAMS AG·Filed 2020·Granted Jun 3, 2025·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →