Inventor · disambiguated record
Vincent Chen
Also filed as: CHEN VINCENT · CHEN VINCENT C · CHEN VINCENT CHIA HUNG
21 granted patents·4 pending applications·51 citations·filing 2003–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD19AIPLUX TECHNOLGY CO LTD1DELL PRODUCTS LP1MACRONIX INT CO LTD1PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC1
Top patents by PatentIndex Score
25 records- 0193US10115685B2Method of manufacturing a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 30, 2018·6 cites·20 claims
- 0291US2025364272A1Semiconductor device and manufacturing method thereofPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2025·Application pending·0 cites
- 0390US10043761B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 7, 2018·5 cites·20 claims
- 0490US9953936B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 24, 2018·5 cites·14 claims
- 0589US10510714B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·20 claims
- 0689US9659879B1Semiconductor device having a guard ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·7 cites·20 claims
- 0788US10050013B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 14, 2018·5 cites·20 claims
- 0885US10128203B2Fan-out package structure, antenna system and associated methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·4 cites·18 claims
- 0982US11211358B2Packaged semiconductor devices and packaging methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·20 claims
- 1082US2024379382A1Manufacturing method of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1178US9601439B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 21, 2017·3 cites·20 claims
- 1277US10763229B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 1, 2020·1 cites·20 claims
- 1377US10510681B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·1 cites·20 claims
- 1475US10043745B2Semiconductor package devices integrated with inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 7, 2018·2 cites·20 claims
- 1573US11004811B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 11, 2021·0 cites·20 claims
- 1671US12046480B2Manufacturing method of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 23, 2024·0 cites·20 claims
- 1769US10727082B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jul 28, 2020·1 cites·20 claims
- 1867US11211339B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·0 cites·20 claims
- 1966US7550721B2Method and apparatus for depositing samples on a target surfaceUNIV MANITOBA·Filed 2006·Granted Jun 23, 2009·2 cites·23 claims
- 2063US2025182226A1A system of trademark risk management and method thereofAIPLUX TECHNOLGY CO LTD·Filed 2024·Application pending·0 cites
- 2162US10475755B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 12, 2019·0 cites·20 claims
- 2256US10510660B2Semiconductor package devices integrated with inductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 2349US7071106B2Method for CMP removal rate compensationTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jul 4, 2006·3 cites·20 claims
- 2442US9866018B2System and method for transistor voltage controlDELL PRODUCTS LP·Filed 2015·Granted Jan 9, 2018·0 cites·19 claims
- 2535US2005074700A1Method for imaging a semiconductor waferMACRONIX INT CO LTD·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →