Inventor · disambiguated record
Victor A. Chiriac
Also filed as: CHIRIAC VICTOR · CHIRIAC VICTOR A · CHIRIAC VICTOR ADRIAN
24 granted patents·8 pending applications·197 citations·filing 2001–2024
95Inventor score
Files withQUALCOMM INC17FREESCALE SEMICONDUCTOR INC6CHIRIAC VICTOR A3GLOBAL COOLING TECH GROUP LLC2ANDERSON JON J1
Top patents by PatentIndex Score
32 records- 0197US7405102B2Methods and apparatus for thermal management in a multi-layer embedded chip structureFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jul 29, 2008·69 cites·12 claims
- 0295US9918407B2Multi-layer heat dissipating device comprising heat storage capabilities, for an electronic deviceQUALCOMM INC·Filed 2016·Granted Mar 13, 2018·19 cites·27 claims
- 0392US7892882B2Methods and apparatus for a semiconductor device package with improved thermal performanceFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 22, 2011·26 cites·10 claims
- 0490US9148979B2Heat dissipating apparatus for folding electronic devicesQUALCOMM INC·Filed 2012·Granted Sep 29, 2015·13 cites·39 claims
- 0589US7778030B1Method for cooling using impinging jet controlFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Aug 17, 2010·19 cites·19 claims
- 0687US9165854B2Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation featuresCHUN DEXTER T·Filed 2012·Granted Oct 20, 2015·11 cites·33 claims
- 0785US9999157B2Multi-phase heat dissipating device embedded in an electronic deviceQUALCOMM INC·Filed 2016·Granted Jun 12, 2018·5 cites·23 claims
- 0882US10353445B2Multi-phase heat dissipating device for an electronic deviceQUALCOMM INC·Filed 2017·Granted Jul 16, 2019·4 cites·24 claims
- 0979US9136202B2Enhanced package thermal management using external and internal capacitive thermal materialCHIRIAC VICTOR A·Filed 2012·Granted Sep 15, 2015·7 cites·13 claims
- 1075US11181323B2Heat-dissipating device with interfacial enhancementsQUALCOMM INC·Filed 2019·Granted Nov 23, 2021·2 cites·20 claims
- 1174US9041212B2Thermal design and electrical routing for multiple stacked packages using through via insert (TVI)QUALCOMM INC·Filed 2013·Granted May 26, 2015·3 cites·27 claims
- 1271US12504234B2Micro-channel pulsating heat pipeGLOBAL COOLING TECH GROUP LLC·Filed 2024·Granted Dec 23, 2025·0 cites·22 claims
- 1370US9329646B2Multi-layer heat dissipating apparatus for an electronic deviceQUALCOMM INC·Filed 2014·Granted May 3, 2016·2 cites·28 claims
- 1469US8595525B2On-chip thermal management techniques using inter-processor time dependent power density data for indentification of thermal aggressorsANDERSON JON J·Filed 2011·Granted Nov 26, 2013·3 cites·40 claims
- 1567US11209215B2Enhanced cooling of an electronic device using micropumps in thermosiphonsQUALCOMM INC·Filed 2018·Granted Dec 28, 2021·1 cites·17 claims
- 1664US8393350B2Methods and apparatus for introducing additives into a fluid flowCHIRIAC VICTOR A·Filed 2006·Granted Mar 12, 2013·2 cites·14 claims
- 1763US6418016B1System and method for cooling using an oscillatory impinging jetMOTOROLA INC·Filed 2001·Granted Jul 9, 2002·9 cites·19 claims
- 1858US10405463B2Multi-rotor aerial drone with vapor chamberQUALCOMM INC·Filed 2017·Granted Sep 3, 2019·1 cites·18 claims
- 1956US11920868B2Micro-channel pulsating heat pipeGLOBAL COOLING TECH GROUP LLC·Filed 2020·Granted Mar 5, 2024·0 cites·13 claims
- 2047US7821787B2System and method for cooling using impinging jet controlFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Oct 26, 2010·0 cites·15 claims
- 2147US2009178436A1Microelectronic refrigeration system and methodFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 2247US2015241092A1Active heat flow control with thermoelectric layersQUALCOMM INC·Filed 2014·Application pending·0 cites
- 2345US10606327B2Heat reduction using selective insulation and thermal spreadingQUALCOMM INC·Filed 2017·Granted Mar 31, 2020·0 cites·26 claims
- 2445US6906900B2Structure and method of thermally protecting power devices for airbag deploymentFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jun 14, 2005·1 cites·21 claims
- 2544US10381562B1Method and apparatus for cooling of an electronic deviceQUALCOMM INC·Filed 2018·Granted Aug 13, 2019·0 cites·22 claims
- 2644US2013286595A1Thermal management floorplan for a multi-tier stacked ic packageQUALCOMM INC·Filed 2012·Application pending·0 cites
- 2742US2019061970A1Multi-rotor aerial drone with thermal energy harvestingQUALCOMM INC·Filed 2017·Application pending·0 cites
- 2841US2007151275A1Methods and apparatus for microelectronic cooling using a miniaturized vapor compression systemCHIRIAC VICTOR·Filed 2006·Application pending·0 cites
- 2940US2019331142A1Methods and apparatus for cooling an electronic device by using an electro-osmotic (eo) pumpQUALCOMM INC·Filed 2018·Application pending·0 cites
- 3039US2007056713A1Integrated cooling design with heat pipesCHIRIAC VICTOR A·Filed 2005·Application pending·0 cites
- 3138US2017295671A1Multi-phase heat dissipating device for an electronic deviceQUALCOMM INC·Filed 2016·Application pending·0 cites
- 3234US11616185B2Energy harvesting device for electronic devicesQUALCOMM INC·Filed 2017·Granted Mar 28, 2023·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →